mm908e625 Freescale Semiconductor, Inc, mm908e625 Datasheet

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mm908e625

Manufacturer Part Number
mm908e625
Description
Integrated Quad Half H-bridge With Power Supply, Embedded Mcu, And Lin Serial Communication
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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Freescale Semiconductor
Advance Information
* This document contains information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2006, 2007. All rights reserved.
Integrated Quad Half H-Bridge
with Power Supply, Embedded
MCU, and LIN Serial
Communication
high-performance HC08 microcontroller with a SMARTMOS
control IC. The HC08 includes Flash Memory, a timer, Enhanced
Serial Communications Interface (ESCI), an Analog-to-Digital
Converter (ADC), Serial Peripheral Interface (SPI) (only internal), and
an Internal Clock Generator (ICG) module. The analog control die
provides fully protected H-Bridge/high-side outputs, voltage regulator,
autonomous watchdog with cyclic wake-up, and Local Interconnect
Network (LIN) physical layer.
application performance adjustments and space-saving PCB design.
It is well suited for the control of automotive mirror, door lock, and
light-levelling applications.
Features
The 908E625 is an integrated single-package solution including a
The single-package solution, together with LIN, provides optimal
• High-Performance M68HC908EY16 Core
• 16K Bytes of On-Chip Flash Memory & 512 Bytes of RAM
• Internal Clock Generation Module
• Two 16-bit, 2-Channel Timers
• 10-Bit Analog-to-Digital Converter
• LIN Physical Layer
• Autonomous Watchdog with Cyclic Wakeup
• Three Two-Pin Hall-Effect Sensor Input Ports
• One Analog Input with Switchable Current Source
• Four Low RDS(ON) Half-Bridge Outputs
• One Low RDS(ON) High-Side Output
• 13 Micro Controller I/Os
• Pb-free packaging designated by suffix code EK
Figure 1. 908E625 Simplified Application Diagram
LIN
VREFH
VDDA
EVDD
VDD
VREFL
VSSA
EVSS
VSS
RST
RST_A
IRQ
IRQ_A
SS
PTB1/AD1
RXD
PTE1/RXD
PTD1/TACH1
FGEN
BEMF
PTD0/TACH0/BEMF
3
VSUP
908E625
2
GND
TM
analog
EP
Port A I/Os
Port B I/Os
Port C I/Os
HVDD
HB1
HB2
HB3
HB4
PA1
HS
H1
H2
H3
MM908E625ACDWB
MM908E625ACEK
M
H-BRIDGE POWER SUPPLY WITH
Device
M
Switchable Internal
Analog Input with
Microcontroller
2-Terminal Hall-Effect
Current Source
High-Side
EMBEDDED MCU AND LIN
ORDERING INFORMATION
Output
V
Sensor Inputs
Ports
M
DD
Three
Output
EK SUFFIX (Pb-FREE)
4 Half-Bridges
Controlling
3 Loads
54-PIN SOICWB-EP
908E625
Document Number: MM908E625
98ARL105910
DWB SUFFIX
-40°C to 85°C
Temperature
Range (T
Rev 6.0, 11/2007
A
)
54 SOICW
Package
EP

Related parts for mm908e625

mm908e625 Summary of contents

Page 1

... PTE1/RXD PA1 Analog Input with PTD1/TACH1 Current Source FGEN Port A I/Os Microcontroller BEMF Port B I/Os Ports PTD0/TACH0/BEMF GND EP Port C I/Os 2 Document Number: MM908E625 Rev 6.0, 11/2007 908E625 DWB SUFFIX EK SUFFIX (Pb-FREE) 98ARL105910 54-PIN SOICWB-EP Temperature Package Range ( SOICW -40°C to 85° Half-Bridges ...

Page 2

INTERNAL BLOCK DIAGRAM GND1-2 VSUP1-3 RST_A IRQ_A BEMF FGEN LIN RXD SS PTE1/RXD PTD1/TACH1 PTD0/TACH0 PTB1/AD1 RST IRQ VREFL Bus Internal VSSA EVSS EVDD VDDA VREFH Figure 2. 908E625 Simplified Internal Block Diagram 908E625 2 INTERNAL BLOCK DIAGRAM C PORT ...

Page 3

PTB7/AD7/TBCH1 PTB6/AD6/TBCH0 PTC4/OSC1 PTC3/OSC2 PTC2/MCLK PTB5/AD5 PTB4/AD4 PTB3/AD3 PTB1/AD1 PTD0/TACH0/BEMF PTD1/TACH1 Figure 3. 908E625 Pin Connections (Transparent Package Top View) Table 1. 908E625 Pin Definitions A functional description of each pin can be found in the Functional Pin Description section ...

Page 4

PIN CONNECTIONS Table 1. 908E625 Pin Definitions (continued) A functional description of each pin can be found in the Functional Pin Description section beginning on Pin Function Pin Pin Name MCU 42 PTE1/RXD MCU 43 VREFL 48 VREFH MCU 44 ...

Page 5

Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings ELECTRICAL RATINGS Supply Voltage Analog Chip Supply Voltage under Normal Operation, Steady ...

Page 6

ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics All characteristics are for the analog chip only. Refer to the 68HC908EY16 specification for characteristics of the microcontroller chip. Characteristics noted under conditions 9.0 V ≤ V ...

Page 7

Table 3. Static Electrical Characteristics (continued) All characteristics are for the analog chip only. Refer to the 68HC908EY16 specification for characteristics of the microcontroller chip. Characteristics noted under conditions 9.0 V ≤ V Typical values noted reflect the approximate parameter ...

Page 8

ELECTRICAL CHARACTERISTICS STATIC ELECTRICAL CHARACTERISTICS Table 3. Static Electrical Characteristics (continued) All characteristics are for the analog chip only. Refer to the 68HC908EY16 specification for characteristics of the microcontroller chip. Characteristics noted under conditions 9.0 V ≤ V Typical values ...

Page 9

Table 3. Static Electrical Characteristics (continued) All characteristics are for the analog chip only. Refer to the 68HC908EY16 specification for characteristics of the microcontroller chip. Characteristics noted under conditions 9.0 V ≤ V Typical values noted reflect the approximate parameter ...

Page 10

ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS DYNAMIC ELECTRICAL CHARACTERISTICS Table 4. Dynamic Electrical Characteristics All characteristics are for the analog chip only. Please refer to the specification for 68HC908EY16 for characteristics of the microcontroller chip. Characteristics noted under conditions 9.0 V ...

Page 11

Table 5. Microcontroller Description For a detailed microcontroller description, refer to the MC68HC908EY16 data sheet. Module ESCI Standard Serial Communication Interface (SCI) Module Bit-Time Measurement Arbitration Prescaler with Fine Baud-Rate Adjustment ICG Internal Clock Generation Module (25% Accuracy with Trim ...

Page 12

ELECTRICAL CHARACTERISTICS TIMING DIAGRAMS t t TXD-LIN-low Tx-LIN-low Tx TXD TXD LIN LIN Recessive State 0.4 V 0.4 VSUP Rx RXD t t LIN-RXD-low LIN-Rx-low ∆t Fall-time 0.8 V 0.8 VSUP SUP 0.2 V 0.2 VSUP SUP SR = ∆t ...

Page 13

T = 25°C J 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.5 Figure 6. Free Wheel Diode Forward Voltage vs I 250 200 150 100 Analog Integrated Circuit Device Data Freescale Semiconductor ELECTRICAL PERFORMANCE ...

Page 14

FUNCTIONAL DESCRIPTION INTRODUCTION The 908E625 device was designed and developed as a highly integrated and cost-effective solution for automotive and industrial applications. For automotive body electronics, the 908E625 is well suited to perform complete mirror, door lock, and light-levelling control ...

Page 15

CURRENT LIMITATION FREQUENCY INPUT PIN (FGEN) Input pin for the half-bridge current limitation and the high- side inrush current limiter PWM frequency. This input is not a real PWM input pin; it should just supply the period of the PWM. ...

Page 16

FUNCTIONAL DESCRIPTION FUNCTIONAL PIN DESCRIPTION ADC REFERENCE PINS (VREFL AND VREFH) VREFL and VREFH are the reference voltage pins for the ADC recommended that a high-quality ceramic decoupling capacitor be placed between these pins. Important VREFH is the ...

Page 17

FUNCTIONAL DEVICE OPERATION INTERRUPTS The 908E625 has seven different interrupt sources as described in the following paragraphs. The interrupts can be disabled or enabled via the SPI. After reset all interrupts are automatically disabled. LOW-VOLTAGE INTERRUPT The Low-Voltage Interrupt (LVI) ...

Page 18

FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES 908E625 18 MCU Die Analog Die From Reset Initialize Operate SPI STOP MREG (MREG off) Wait for Action STOP Hallport IRQ Assert IRQ_A Interrupt? SPI: Reason for Interrupt MREG Operate MREG = Main ...

Page 19

SERIAL SPI INTERFACE The SPI creates the communication link between the microcontroller and the 908E625. The interface consists of four pins. See • —Slave Select SS • MOSI—Master-Out Slave-In SS Read/Write, Address, Parity MOSI R System Status Register ...

Page 20

FUNCTIONAL DEVICE OPERATION OPERATIONAL MODES SLAVE DATA BYTE Contains the contents of selected register. During a write operation it includes the register content prior to a write operation. Table 6. List of Registers Addr Register Name R/W R H-Bridge Output ...

Page 21

INTERRUPT FLAG REGISTER (IFR Register Name and Address: IFR - $05 Bits Read 0 HPF LINF HTF LVF Write Reset Hall-Effect Sensor Input Pin Flag Bit (HPF) This read/write flag ...

Page 22

FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS INTERRUPT MASK REGISTER (IMR) Register Name and Address: IMR - $04 Bits Read 0 HPIE LINIE HTIE LVIE Write Reset Hall-Effect Sensor Input ...

Page 23

RESET The 908E625 chip has four internal reset sources and one external reset source, as explained in the paragraphs below. Figure 11 depicts the internal reset sources. RESET INTERNAL SOURCES Autonomous Watchdog AWD modules generates a reset because of a ...

Page 24

FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS RESET EXTERNAL SOURCE External Reset Pin The microcontroller has the capability of resetting the SMARTMOS device by pulling down the ™ RESET MASK REGISTER (RMR) Register Name and Address: RMR - $06 Bits ...

Page 25

ANALOG DIE I/OS LIN Physical Layer The LIN bus pin provides a physical layer for single-wire communication in automotive applications. The LIN physical layer is designed to meet the LIN physical layer specification. The LIN driver is a low-side MOSFET ...

Page 26

FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS Table 7. Analog Multiplexer Configuration Register SS3 SS2 SS1 SS0 Current Recopy HB1 Current Recopy HB2 Current Recopy HB3 0 0 ...

Page 27

POWER OUTPUT REGISTER (POUT) Register Name and Address: POUT - $0b Bits Read 0 0 CSSEL1 CSSEL0 CSEN Write Reset Notes 15. This bit must always be set to 0. ...

Page 28

FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS HxEN HxF Figure 13. Hall-Effect Sensor Input Pin Connected to Two-Pin Hall-Effect Sensor HxEN HxF Figure 14. Hall-Effect Sensor Input Pin Connected to Local Switch 908E625 28 Two-Terminal Hall-Effect Sensor Hx Sense Circuitry ...

Page 29

HxEN Sense Circuitry HxF Figure 15. Hall-Effect Sensor Input Pin Connected to Three-Pin Hall-Effect Sensor Interrupts The Hall-effect sensor input pins are interrupt capable. How and when an interrupt occurs is dependent on the operating mode, RUN or Stop. RUN ...

Page 30

FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS SPI: AWDCC = STOP No IRQ? Yes SPI: Reason for Wakeup Operate MREG = Main Voltage Regulator Figure 16. Hall-Effect Sensor Input Pin Cyclic Check Wake-Up Feature HALL-EFFECT SENSOR ...

Page 31

HALL-EFFECT SENSOR INPUT PIN STATUS REGISTER (HASTAT) Register Name and Address: HASTAT - $09 Bits Read Write Reset Hall-Effect Sensor Input Pin Flag Bits (H3F:H1F) ...

Page 32

FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS HALF-BRIDGE OUTPUT REGISTER (HBOUT) Register Name and Address: HBOUT - $01 Bits Read HB4 HB4 HB3 HB3 HB2 ...

Page 33

Coil Current Half-Bridge Low-Side Output FGEN Input (MCU PWM Signal) Minimum 50 µs OFFSET CHOPPING If bit OFC_EN in the H-Bridge Control Register (HBCTL) is set, HB1 and HB2 will continue to switch on the low-side MOSFETs with the rising ...

Page 34

FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS Coil1 Current Coil2 Current FGEN Input (MCU PWM Signal) Current in VSUP Line Figure 19. Offset Chopping for Step Motor Control HALF-BRIDGE CURRENT RECOPY Each low-side MOSFET has an additional sense output to ...

Page 35

HALF-BRIDGE OVERTEMPERATURE PROTECTION The half-bridge outputs provide an overtemperature pre- warning with the HTF in the Interrupt Flag Register (IFR). In order to protect the outputs against overtemperature, the High-Temperature Reset must be enabled. If this value is reached, ...

Page 36

FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS H-Bridges Current Sense Amplification Select Bit (CSA) This read/write bit selects the current sense amplification of the H-Bridges. Reset clears the CSA bit. • Current sense amplification set for measuring 0.5 ...

Page 37

HIGH-SIDE OVERTEMPERATURE PROTECTION The high-side output provides an overtemperature pre- warning with the HTF in the Interrupt Flag Register. In order to protect the output against overtemperature, the High- Temperature Reset must be enabled. If this value is reached, the ...

Page 38

FUNCTIONAL DEVICE OPERATION LOGIC COMMANDS AND REGISTERS SYSTEM CONTROL REGISTER (SYSCTL) Register Name and Address: SYSCTL - $03 Bits Read 0 0 PSON SRS1 SRS0 Write Reset Power Stages On ...

Page 39

Overtemperature Status Bit (HTF) This read-only bit is a copy of the HTF bit in the Interrupt Flag Register. • Overtemperature condition has occurred • overtemperature condition has occurred AUTONOMOUS WATCHDOG (AWD) The Autonomous Watchdog ...

Page 40

FUNCTIONAL DEVICE OPERATION FACTORY TRIMMING AND CALIBRATION Autonomous Watchdog Rate Bit (AWDR) This read/write bit selects the clock rate of the Autonomous Watchdog. Reset clears the AWDR bit. • Fast rate selected (10 ms) • Slow ...

Page 41

... TYPICAL APPLICATIONS FACTORY TRIMMING AND CALIBRATION Figure 23) and not to provide the analog chip - ). IRQ IRQ_A VSUP[1:3] VDD GND[1:2] VSS +5V VREFH VDDA RST EVDD RST_A 100nF IRQ VREFL MM908E625 IRQ_A VSSA EVSS PTC4/OSC1 10k PTB4/AD4 10k PTA1/KBD1 PTA0/KBD0 10k PTB3/AD3 908E625 4.7µF +5V 41 ...

Page 42

... DD ≤ ≤ 4.5V TST VSUP[1:3] VDD VSS GND[1:2] VREFH VDDA RST EVDD RST_A 100nF IRQ VREFL MM908E625 IRQ_A VSSA EVSS CLK PTC4/OSC1 10k PTB4/AD4 10k PTA1/KBD1 PTA0/KBD0 10k PTB3/AD3 Communication Speed Normal Request External Baud Timeout Bus Clock Frequency Rate 9 ...

Page 43

... Figure 25 schematics and layout level and recommended external components and layout considerations. VSUP1 + C2 VSUP2 C1 VSUP3 LIN C5 MM908E625 GND1 GND2 Figure 25. EMC/EMI recommendations TYPICAL APPLICATIONS FACTORY TRIMMING AND CALIBRATION and Figure 26 show the recommendations on Table 13 incidates VDD VSS ...

Page 44

TYPICAL APPLICATIONS FACTORY TRIMMING AND CALIBRATION L1 LIN GND VBAT D1 . Component Recommended Value D1 C1 Bulk Capacitor C2 100nF, SMD Ceramic, Low ESR C3 100nF, SMD Ceramic, Low ESR C4 4,7uF, SMD Ceramic, Low ESR C5 180pF, SMD ...

Page 45

Important: For the most current revision of the package, visit 98ARL105910. 10.3 5 7 PIN 1 INDEX 5. TIPS 0 10.9 9.7 0.30 ...

Page 46

... All electrical, application and packaging information is provided in the data sheet. Package and Thermal Considerations This MM908E625 is a dual die package. There are two heat sources in the package independently heating with P 1 temperatures, T ...

Page 47

PTB7/AD7/TBCH1 1 54 PTB6/AD6/TBCH0 2 53 PTC4/OSC1 3 52 PTC3/OSC2 4 51 PTC2/MCLK 5 50 PTB5/AD5 6 49 PTB4/AD4 7 48 PTB3/AD3 8 47 IRQ 9 46 RST 10 45 PTB1/AD1 11 44 PTD0/TACH0/BEMF 12 43 PTD1/TACH1 ...

Page 48

... Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com MM908E625 Rev 6.0 11/2007 RoHS-compliant and/or Pb-free versions of Freescale products have the functionality and electrical characteristics of their non-RoHS-compliant and/or non-Pb-free counterparts. For further information, see http://www.freescale.com Freescale sales representative. For information on Freescale’ ...

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