sc18is602b NXP Semiconductors, sc18is602b Datasheet - Page 18

• Manufacturer Part Number: sc18is602b
• Description: I2c-bus To Spi Bridge
• Manufacturer: NXP Semiconductors

NXP Semiconductors
12. Package outline
Fig 21. Package outline SOT403-1 (TSSOP16)
SC18IS602B
Product data sheet
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT403-1
max.
1.1
A
0.15
0.05
A
1
16
1
0.95
0.80
A
2
y
IEC
Z
0.25
pin 1 index
A
3
e
D
0.30
0.19
b
p
All information provided in this document is subject to legal disclaimers.
MO-153
JEDEC
0.2
0.1
c
b
p
REFERENCES
9
8
D
5.1
4.9
0
(1)
Rev. 5 — 3 August 2010
w
E
4.5
4.3
M
(2)
JEITA
scale
2.5
0.65
e
c
A
H
6.6
6.2
2
E
A
1
5 mm
L
1
0.75
0.50
L
H
p
E
E
detail X
0.4
0.3
Q
L
L
PROJECTION
EUROPEAN
p
0.2
v
Q
SC18IS602B
A
(A )
0.13
3
w
I
2
C-bus to SPI bridge
X
θ
v
0.1
A
© NXP B.V. 2010. All rights reserved.
y
M
ISSUE DATE
A
99-12-27
03-02-18
0.40
0.06
Z
(1)
SOT403-1
8
0
θ
o
o
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