mc33888apnbr2 Freescale Semiconductor, Inc, mc33888apnbr2 Datasheet - Page 36

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mc33888apnbr2

Manufacturer Part Number
mc33888apnbr2
Description
Quad High-side And Octal Low-side Switch For Automotive
Manufacturer
Freescale Semiconductor, Inc
Datasheet
Device on Thermal Test Board
36
33888
ADDITIONAL DOCUMENTATION
THERMAL ADDENDUM (REV 2.0)
Material:
Outline:
Area A:
Ambient Conditions:
12.0 mm x 12.0 mm Body
33888 Pin Connections
36-Pin PQFN
0.8 mm Pitch
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
80 mm x 100 mm board area,
including edge connector for thermal
testing
Cu heat-spreading areas on board
surface
Natural convection, still air
Figure 15. Thermal Test Board
Table 17. Thermal Resistance Performance
ambient air.
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
Resistance
Ρ
Thermal
θJAmn
Ρθ
This device is a dual die package. Index m indicates the
JA
is the thermal resistance between die junction and
Area A
(mm
300
600
0
2
)
Analog Integrated Circuit Device Data
1 = Power Chip, 2 = Logic Chip (°C/W)
m = 1,
n = 1
37
29
28
Freescale Semiconductor
m = 1, n = 2
m = 2, n = 1
36
29
27
m = 2,
n = 2
37
30
29

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