mc33662 Freescale Semiconductor, Inc, mc33662 Datasheet - Page 6

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mc33662

Manufacturer Part Number
mc33662
Description
Lin 2.1 / Saej2602-2, Lin Physical Layer
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings (continued)
permanent damage to the device.
6
33662
ELECTRICAL RATINGS (CONTINUED)
THERMAL RATINGS
Notes
ESD Capability - AECQ100
Operating Temperature
Storage Temperature
Thermal Resistance, Junction to Ambient
Peak Package Reflow Temperature During Solder Mounting
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis Temperature
All voltages are with respect to ground, unless otherwise noted. Exceeding these ratings may cause a malfunction or
3.
Human Body Model - JESD22/A114 (C
Charge Device Model - JESD22/C101 (C
Machine Model - JESD22/A115 (C
According to “Hardware Requirements for LIN, CAN and Flexray Interfaces in
Automotive Applications” specification Rev1.1 / December 2nd, 2009 (C
R
Contact Discharge, Unpowered
- Annex F)
According to ISO10605 - Rev 2008 test specification
(2.0 kΩ / 150 pF) - Unpowered - Contact discharge
(2.0 kΩ / 330 pF) - Powered - Contact discharge
Ambient
Junction
ZAP
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
LIN pin without capacitor
LIN pin with 220 pF capacitor
VSUP (10 µF to ground)
WAKE (2*18 kΩ serial resistor)
INH pin
LIN pin with 220 pF capacitor and indirect ESD coupling (according to ISO10605
LIN pin without capacitor
LIN pin with 220 pF capacitor
VSUP (10 µF to ground)
WAKE (2*18 kΩ serial resistor)
LIN pin without capacitor
LIN pin with 220 pF capacitor
VSUP (10 µF to ground)
WAKE (2*18 kΩ serial resistor)
Corner pins (Pins 1, 4, 5 and 8)
All other pins (Pins 2, 3, 6 and 7)
All pins
LIN pin versus GND
Wake pin versus GND
INH pin versus GND
All other pins
= 330 Ω)
ZAP
Ratings
= 220 pF, R
ZAP
ZAP
= 100 pF, R
= 4.0 pF)
ZAP
= 0 Ω)
ZAP
(3)
= 1500 Ω)
ZAP
= 150 pF,
T
Symbol
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
SOLDER
T
T
ESD1-1
ESD1-2
ESD1-3
ESD1-4
ESD2-1
ESD2-2
ESD3-1
ESD4-1
ESD4-2
ESD4-3
ESD4-4
ESD4-5
ESD4-6
ESD5-1
ESD5-2
ESD5-3
ESD5-4
ESD6-1
ESD6-2
ESD6-3
ESD6-4
T
R
SHUT
HYST
T
T
STG
θ
A
J
JA
Analog Integrated Circuit Device Data
- 40 to 125
- 40 to 150
- 40 to 150
150 to 200
Freescale Semiconductor
± 10.0 k
>± 15 k
± 8.0 k
± 8.0 k
± 4.0 k
Value
±2.0 k
± 15 k
± 15 k
±25 k
±20 k
± 20 k
± 25 k
±25 k
±25 k
± 10 k
±12 k
±15 k
± 750
± 500
± 200
± 8 k
150
240
20
°C/W
Unit
°C
°C
°C
°C
°C
V

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