hcpl-2503-560e Avago Technologies, hcpl-2503-560e Datasheet - Page 4

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hcpl-2503-560e

Manufacturer Part Number
hcpl-2503-560e
Description
Single Channel, High Speed Logic Interface Optocoupler
Manufacturer
Avago Technologies
Datasheet
4
Solder Reflow Temperature Profile
Recommended Pb-Free IR Profile
TEMPERATURE
NOTES:
THE TIME FROM 25
T
Note: Non-halide flux should be used.
T
T
smax
ROOM
smax
smin
25
T
T
p
L
= 200
150 - 200
217
°
300
200
100
°
C, T
C
0
Note: Non-halide flux should be used.
0
t 25
3
°
60 to 180 SEC.
smin
C
°
PREHEAT
C/SEC. MAX.
°
PREHEATING RATE 3 ° C + 1 ° C/- 0.5 ° C/SEC.
REFLOW HEATING RATE 2.5 ° C ± 0.5 ° C/SEC.
160 ° C
150 ° C
140 ° C
°
C to PEAK TEMPERATURE = 8 MINUTES MAX.
C to PEAK
RAMP-UP
= 150
t
s
260 +0/-5
°
C
TIME
50
°
C
3 ° C + 1 ° C/- 0.5 ° C
PREHEATING TIME
150 ° C, 90 + 30 SEC.
t
t
L
p
2.5 ° C ± 0.5 ° C/SEC.
TIME WITHIN 5
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
100
RAMP-DOWN
6
TIME (SECONDS)
°
C/SEC. MAX.
TEMP.
PEAK
245 ° C
°
C of ACTUAL
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200 ° C
TIME
200
PEAK
TEMP.
240 ° C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230 ° C
250

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