nlas4684 ON Semiconductor, nlas4684 Datasheet - Page 13

• Manufacturer Part Number: nlas4684
• Description: Dual Spdt .5 Ohm Analog Switch
• Manufacturer: ON Semiconductor

10X
2X
2X
REFERENCE
0.10 C
0.05 C
10X
10X
0.10 C
0.08 C
0.15 C
K
L
PIN 1
0.15 C
NOTE 3
A B
10X
Ç Ç Ç Ç
Ç Ç Ç Ç
Ç Ç Ç Ç
DETAIL B
b
10
BOTTOM VIEW
1
SIDE VIEW
TOP VIEW
e
D2
D
5
6
(A3)
A1
DETAIL A
A
B
E
E2
A
DFN10, 3 x 3mm, 0.5mm Pitch
PACKAGE DIMENSIONS
C
SEATING
PLANE
http://onsemi.com
L1
MOLD CMPD
CASE 485C-01
NLAS4684
ISSUE A
Bottom View
A1
(Optional)
DETAIL A
13
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
É É É É
É É
Side View
(Optional)
DETAIL B
EDGE OF PACKAGE
0.5651
10X
2.1746
0.3008
EXPOSED Cu
10X
SOLDERING FOOTPRINT*
A3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. TERMINAL b MAY HAVE MOLD COMPOUND
6. DETAILS A AND B SHOW OPTIONAL VIEWS
2.6016
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MATERIAL ALONG SIDE EDGE. MOLD
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE.
DIM
A1
A3
D2
E2
L1
A
D
K
b
E
e
L
MILLIMETERS
MIN
0.80
0.00
0.18
2.45
1.75
0.35
0.00
3.00 BSC
3.00 BSC
0.50 BSC
0.20 REF
0.19 TYP
DIMENSIONS: MILLIMETERS
MAX
1.00
0.05
0.30
2.55
1.85
0.45
0.03
0.5000 PITCH
1.8508
3.3048