MC100EL31DTG ON Semiconductor, MC100EL31DTG Datasheet

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MC100EL31DTG

Manufacturer Part Number
MC100EL31DTG
Description
IC FLIP FLOP ECL SET/RST 8-TSSOP
Manufacturer
ON Semiconductor
Series
100ELr
Type
D-Typer
Datasheet

Specifications of MC100EL31DTG

Function
Set(Preset) and Reset
Output Type
Differential
Number Of Elements
1
Number Of Bits Per Element
1
Frequency - Clock
2.8GHz
Delay Time - Propagation
465ps
Trigger Type
Positive Edge
Voltage - Supply
4.2 V ~ 5.7 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-TSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Output High, Low
-
Other names
MC100EL31DTGOS
MC10EL31, MC100EL31
5 V ECL D Flip‐Flop
With Set and Reset
device is functionally equivalent to the E131 device with higher
performance capabilities. With propagation delays and output
transition times significantly faster than the E131, the EL31 is ideally
suited for those applications which require the ultimate in AC
performance.
Data enters the master portion of the flip-flop when clock is LOW and
is transferred to the slave, and thus the outputs, upon a positive
transition of the clock.
Features
© Semiconductor Components Industries, LLC, 2008
August, 2008 − Rev. 6
The MC10EL/100EL31 is a D flip-flop with set and reset. The
Both set and reset inputs are asynchronous, level triggered signals.
The 100 Series contains temperature compensation.
> 100 V Machine Model
with V
with V
For Additional Information, see Application Note AND8003/D
Oxygen Index: 28 to 34
475 ps Propagation Delay
2.8 GHz Toggle Frequency
ESD Protection: > 1 kV Human Body Model,
PECL Mode Operating Range: V
NECL Mode Operating Range: V
Internal Input Pulldown Resistors on D, CLK, S, and R
Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Moisture Sensitivity Level 1
Flammability Rating: UL 94 V−0 @ 0.125 in,
Metastability 125 ps (see Application Note AN1504)
Transistor Count = 79 devices
Pb−Free Packages are Available
EE
EE
= −4.2 V to −5.7 V
= 0 V
CC
CC
= 4.2 V to 5.7 V
= 0 V
1
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
H = MC10
K = MC100
4T = MC10
2I = MC100
A = Assembly Location
CASE 506AA
CASE 948R
MN SUFFIX
*For additional marking information, refer to
DT SUFFIX
8
CASE 751
D SUFFIX
TSSOP−8
(Note: Microdot may be in either location)
Application Note AND8002/D.
SOIC−8
8
DFN8
ORDERING INFORMATION
1
1
http://onsemi.com
8
1
8
1
ALYWG
Publication Order Number:
HEL31
ALYW
HL31
1
L = Wafer Lot
Y = Year
W = Work Week
M = Date Code
G = Pb−Free Package
DIAGRAMS*
G
G
MARKING
4
8
1
8
1
MC10EL31/D
ALYWG
1
KEL31
ALYW
KL31
G
G
4

Related parts for MC100EL31DTG

MC100EL31DTG Summary of contents

Page 1

MC10EL31, MC100EL31 5 V ECL D Flip‐Flop With Set and Reset The MC10EL/100EL31 flip-flop with set and reset. The device is functionally equivalent to the E131 device with higher performance capabilities. With propagation delays and output transition times ...

Page 2

CLK Figure 1. Logic Diagram and Pinout Assignment Table 3. MAXIMUM RATINGS Symbol Parameter V PECL Mode Power Supply CC V NECL Mode Power Supply EE V PECL Mode Input ...

Page 3

Table 4. 10EL SERIES PECL DC CHARACTERISTICS Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note Output LOW Voltage (Note Input HIGH Voltage IH V Input LOW Voltage IL I Input ...

Page 4

Table 6. 100EL SERIES PECL DC CHARACTERISTICS Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note Output LOW Voltage (Note Input HIGH Voltage IH V Input LOW Voltage IL I Input ...

Page 5

Table 8. AC CHARACTERISTICS V CC Symbol Characteristic f Maximum Toggle Frequency max t Propagation Delay PLH t to Output PHL t Setup Time S t Hold Time H t Set/Reset Recovery RR t Minimum Pulse Width PW CLK, Set, ...

Page 6

... MC10EL31DTR2 MC10EL31DTR2G MC10EL31MNR4 MC10EL31MNR4G MC100EL31D MC100EL31DG MC100EL31DR2 MC100EL31DR2G MC100EL31DT MC100EL31DTG MC100EL31DTR2 MC100EL31DTR2G MC100EL31MNR4 MC100EL31MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D ...

Page 7

... G C SEATING PLANE −Z− 0.25 (0.010 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.10 (0.004 SOLDERING FOOTPRINT* 1 ...

Page 8

K 8x REF 0.10 (0.004) 0.15 (0.006 L −U− PIN 1 IDENT 0.15 (0.006 −V− C 0.10 (0.004) D −T− G SEATING PLANE PACKAGE DIMENSIONS TSSOP−8 ...

Page 9

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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