MC10H131M ON Semiconductor, MC10H131M Datasheet

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MC10H131M

Manufacturer Part Number
MC10H131M
Description
IC FLIP FLOP MASTER DL 16SOEIAJ
Manufacturer
ON Semiconductor
Series
10Hr
Type
D-Typer
Datasheet

Specifications of MC10H131M

Function
Set(Preset) and Reset
Output Type
Differential
Number Of Elements
2
Number Of Bits Per Element
1
Frequency - Clock
250MHz
Delay Time - Propagation
1ns
Trigger Type
Positive Edge
Voltage - Supply
4.9 V ~ 5.46 V
Operating Temperature
0°C ~ 75°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (5.3mm Width), 16-SO, 16-SOEIIJ
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Current - Output High, Low
-

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MC10H131
Dual D Type Master−Slave
Flip−Flop
Description
duplication of the standard MECL 10K™ family part, with 100%
improvement in clock speed and propagation delay and no increase in
power−supply current.
Features
*For additional information on our Pb−Free strategy and soldering details, please
© Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 7
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
The MC10H131 is a MECL 10H™ part which is a functional/pinout
Temperature Range)
Propagation Delay, 1.0 ns Typical
Power Dissipation, 235 mW Typical
Improved Noise Margin 150 mV (Over Operating Voltage and
Voltage Compensated
MECL 10K Compatible
Pb−Free Packages are Available*
1
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
16
20 1
*For additional marking information, refer to
CASE 620A
SOEIAJ−16
FN SUFFIX
Application Note AND8002/D.
CASE 648
CASE 966
CASE 775
1
P SUFFIX
L SUFFIX
PLLC−20
CDIP−16
PDIP−16
A
WL, L
YY, Y
WW, W = Work Week
G
ORDERING INFORMATION
http://onsemi.com
= Assembly Location
= Wafer Lot
= Year
= Pb−Free Package
16
MARKING DIAGRAMS*
1
Publication Order Number:
16
1
MC10H131L
AWLYYWW
AWLYYWW
AWLYYWWG
MC10H131P
10H131G
ALYWG
10H131
1 20
MC10H131/D

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MC10H131M Summary of contents

Page 1

... MECL 10K Compatible • Pb−Free Packages are Available* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2006 February, 2006 − Rev. 7 http://onsemi.com MARKING DIAGRAMS* CDIP− ...

Page 2

CE1 CC1 CC2 CE2 Figure 1. Logic Diagram CC1 ...

Page 3

Table 4. ELECTRICAL CHARACTERISTICS Symbol Characteristic I Power Supply Current E I Input Current High inH Pins 6, 11 Pin 9 Pins 7, 10 Pins Input Current Low inL V High Output Voltage OH V ...

Page 4

... Device MC10H131FN MC10H131FNG MC10H131FNR2 MC10H131FNR2G MC10H131L MC10H131M MC10H131MG MC10H131MEL MC10H131MELG MC10H131P MC10H131PG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Package PLLC−20 PLLC−20 (Pb−Free) PLLC−20 PLLC− ...

Page 5

Y BRK −L− −M− 0.007 (0.180) Z 0.007 (0.180 −T− J VIEW S G1 0.010 (0.250) T L− NOTES: 1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, ...

Page 6

VIEW 0.10 (0.004) 0.13 (0.005 0.25 (0.010) PACKAGE DIMENSIONS SOEIAJ−16 CASE 966−01 ISSUE ...

Page 7

... American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 7 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. ...

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