lm2991qml National Semiconductor Corporation, lm2991qml Datasheet - Page 5

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lm2991qml

Manufacturer Part Number
lm2991qml
Description
Lm2991qml Negative Low Dropout Adjustable Regulator
Manufacturer
National Semiconductor Corporation
Datasheet
V
Ref
LM2991 Electrical Characteristics
Symbol
DC Drift Parameters
The following conditions apply, unless otherwise specified.
DC:
S−Level product ONLY.
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2: The maximum power dissipation must be derated at elevated temperatures and is dictated by T
to ambient thermal resistance), and T
number given in the Absolute Maximum Ratings, whichever is lower.
Note 3: The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full advantage of this
improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either metal traces on, or thermal vias through, the
printed circuit board. Without this additional heat sinking, device power dissipation must be calculated using θ
assumed that the device leads will provide substantial heat transfer out the package, since the thermal resistance of the leadframe material is very poor, relative to
the material of the package base. The stated θ
between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and must combine this with the
stated value for the package, to calculate the total allowed power dissipation for the device. The user must determine the value of the additional thermal resistance
and must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device.
Note 4: Human body model, 1.5 kΩ in series with 100 pF.
V
I
Reference Voltage
= −10V, V
O
Parameter
= −3V, I
A
(ambient temperature). The maximum allowable power dissipation at any temperature is P
O
= 1A, C
JC
thermal resistance is for the package material only, and does not account for the additional thermal resistance
O
= 47µF, R
5mA ≤ I
O
L
≤ 1A
Conditions
= 2.7KΩ Deltas not required on B−Level product. Deltas required for
(Continued)
5
Jmax
Notes
(maximum junction temperature), θ
JA
, rather than θ
Min
JC
Max
±
, thermal resistance. It must not be
20
Dmax
= (T
Units
mV
Jmax
JA
(package junction
- T
www.national.com
A
)/θ
groups
JA
Sub-
or the
1

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