stm8af6166tdy STMicroelectronics, stm8af6166tdy Datasheet - Page 78

• Manufacturer Part Number: stm8af6166tdy
• Description: Automotive 8-bit Mcu, With Up To 32 Kbytes Flash, Data Eeprom, 10-bit Adc, Timers, Lin, Spi, I2c, 3 To 5.5 V
• Manufacturer: STMicroelectronics

Electrical characteristics
10.4
10.4.1
78/91
Thermal characteristics
In case the maximum chip junction temperature (T
operating conditions on page 51
guaranteed.
T
Where:
Table 48.
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
Reference document
JESD51-2 integrated circuits thermal test method environment conditions - natural
convection (still air). Available from www.jedec.org.
Jmax
environment.
Symbol
–
–
–
–
–
, in degrees Celsius, may be calculated using the following equation:
Θ
Θ
Θ
JA
JA
JA
T
Θ
P
P
chip internal power.
P
Where:
P
taking into account the actual V
in the application.
Amax
Dmax
INTmax
I/Omax
I/Omax
JA
Thermal characteristics
is the package junction-to-ambient thermal resistance in ° C/W
Thermal resistance junction-ambient
LQFP 48 - 7 x 7 mm
Thermal resistance junction-ambient
LQFP 32 - 7 x 7 mm
Thermal resistance junction-ambient
VFQFPN32
is the maximum ambient temperature in ° C
is the sum of P
= Σ (V
represents the maximum power dissipation on output pins
is the product of I
OL
*I
OL
) + Σ ((V
Doc ID 14952 Rev 5
T
INTmax
Jmax
is exceeded, the functionality of the device cannot be
Parameter
DD
= T
DD
(1)
and P
and V
Amax
-V
OL
OH
/I
I/Omax
OL
DD
)*I
+ (P
, expressed in Watts. This is the maximum
OH
and V
Dmax
),
Jmax
(P
OH
Dmax
) specified in
x Θ
/I
OH
JA
= P
of the I/Os at low and high level
)
INTmax
STM8AF61xx, STM8AF62xx
Table 23: General
+ P
Value
57
59
25
I/Omax
)
°C/W
°C/W
°C/W
Unit