hip2100 Intersil Corporation, hip2100 Datasheet

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hip2100

Manufacturer Part Number
hip2100
Description
100 V/2 A Peak High-frequency Half Bridge Driver With Cmos Logic Inputs
Manufacturer
Intersil Corporation
Datasheet

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100V/2A Peak, Low Cost, High Frequency
Half Bridge Driver
The HIP2100 is a high frequency, 100V Half Bridge
N-Channel power MOSFET driver IC. The low-side and
high-side gate drivers are independently controlled and
matched to 8ns. This gives the user maximum flexibility in
dead-time selection and driver protocol. Undervoltage
protection on both the low-side and high-side supplies force
the outputs low. An on-chip diode eliminates the discrete
diode required with other driver ICs. A new level-shifter
topology yields the low-power benefits of pulsed operation
with the safety of DC operation. Unlike some competitors,
the high-side output returns to its correct state after a
momentary undervoltage of the high-side supply.
Ordering Information
NOTES:
HIP2100IB
HIP2100IBZ (Note 1) -40 to 125 8 Ld SOIC (Pb-free) M8.15
HIP2100EIB
HIP2100EIBZ
(Note 1)
HIP2100IR
HIP2100IRZ (Note 1)
HIP2100IR4
HIP2100IR4Z
(Note 1)
1. Intersil Pb-free products employ special Pb-free material sets;
2. Add “T” suffix for Tape and Reel packing option.
molding compounds/die attach materials and 100% matte tin
plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak
reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020C.
PART #
RANGE (°C)
-40 to 125 8 Ld SOIC
-40 to 125 8 Ld EPSOIC
-40 to 125 8 Ld EPSOIC
-40 to 125 16 Ld 5x5 QFN
-40 to 125 16 Ld 5x5 QFN
-40 to 125 12 Ld 4x4 DFN
-40 to 125 12 Ld 4x4 DFN
TEMP.
®
1
(Pb-free)
(Pb-free)
(Pb-free)
Data Sheet
PACKAGE
M8.15
M8.15C
M8.15C
L16.5x5
L16.5x5
L12.4x4A
L12.4x4A
DWG. #
PKG.
1-888-INTERSIL or 321-724-7143
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
Features
• Drives N-Channel MOSFET Half Bridge
• SOIC, EPSOIC, QFN and DFN Package Options
• SOIC, EPSOIC and DFN Packages Compliant with 100V
• Pb-Free Product Available (RoHS Compliant)
• Bootstrap Supply Max Voltage to 114VDC
• On-Chip 1Ω Bootstrap Diode
• Fast Propagation Times for Multi-MHz Circuits
• Drives 1000pF Load with Rise and Fall Times Typ. 10ns
• CMOS Input Thresholds for Improved Noise Immunity
• Independent Inputs for Non-Half Bridge Topologies
• No Start-Up Problems
• Outputs Unaffected by Supply Glitches, HS Ringing Below
• Low Power Consumption
• Wide Supply Range
• Supply Undervoltage Protection
• 3Ω Driver Output Resistance
• QFN/DFN Package:
Applications
• Telecom Half Bridge Power Supplies
• Avionics DC-DC Converters
• Two-Switch Forward Converters
• Active Clamp Forward Converters
Conductor Spacing Guidelines of IPC-2221
Ground, or HS Slewing at High dv/dt
- Compliant to JEDEC PUB95 MO-220
- Near Chip Scale Package footprint, which improves
QFN - Quad Flat No Leads - Package Outline
PCB efficiency and has a thinner profile
October 21, 2004
All other trademarks mentioned are the property of their respective owners.
|
Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2004. All Rights Reserved.
HIP2100
FN4022.13

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hip2100 Summary of contents

Page 1

... Ordering Information TEMP. PART # RANGE (°C) PACKAGE HIP2100IB -40 to 125 8 Ld SOIC HIP2100IBZ (Note 1) -40 to 125 8 Ld SOIC (Pb-free) M8.15 HIP2100EIB -40 to 125 8 Ld EPSOIC HIP2100EIBZ -40 to 125 8 Ld EPSOIC (Note 1) (Pb-free) HIP2100IR -40 to 125 16 Ld 5x5 QFN ...

Page 2

... Pinouts HIP2100 (SOIC, EPSOIC) TOP VIEW EPAD NOTE: EPAD = Exposed PAD. Application Block Diagram PWM CONTROLLER 2 HIP2100 HIP2100IR4 (DFN) TOP VIEW EPAD ...

Page 3

... PWM FIGURE 2. FORWARD CONVERTER WITH AN ACTIVE CLAMP 3 HIP2100 UNDER LEVEL SHIFT VOLTAGE UNDER VOLTAGE EPAD (EPSOIC, QFN and DFN PACKAGES ONLY) +48V HIP2100 FIGURE 1. TWO-SWITCH FORWARD CONVERTER +48V HIP2100 HB HO DRIVER HS LO DRIVER SECONDARY CIRCUIT ISOLATION SECONDARY CIRCUIT ISOLATION FN4022.13 ...

Page 4

... CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the recommended operating conditions of this specification is not implied. NOTES: 3. The HIP2100 is capable of derated operation at supply voltages exceeding 14V. Figure 16 shows the high-side voltage derating curve for this mode of operation. 4. All voltages referenced to V unless otherwise specified ...

Page 5

... Either Output Rise/Fall Time (3V to 9V) Either Output Rise Time Driving DMOS Either Output Fall Time Driving DMOS Minimum Input Pulse Width that Changes the Output Bootstrap Diode Turn-On or Turn-Off Time 5 HIP2100 = 12V 0V, No Load HO, Unless Otherwise Specified (Continued ...

Page 6

... HPLH t LPLH HO, LO FIGURE 3. Typical Performance Curves 150°C 0 125° 25° -40°C 0.01 10 100 FREQUENCY (kHz) FIGURE 5. OPERATING CURRENT vs FREQUENCY 6 HIP2100 DESCRIPTION . Bootstrap diode connected to HB HPHL LO t LPHL 0.1 0.01 10 1000 FIGURE FREQUENCY ...

Page 7

... TEMPERATURE (°C) FIGURE 9. UNDERVOLTAGE LOCKOUT THRESHOLD vs TEMPERATURE 30 t HPHL t HPLH t LPHL 25 t LPLH TEMPERATURE (°C) FIGURE 11. PROPAGATION DELAYS vs TEMPERATURE 7 HIP2100 (Continued) 500 400 300 200 100 100 150 FIGURE 8. LOW LEVEL OUTPUT VOLTAGE vs TEMPERATURE 0.54 0.5 0.46 DDR 0.42 0.38 HBR 0.34 0.3 100 150 FIGURE 10. UNDERVOLTAGE LOCKOUT HYSTERESIS vs 2 ...

Page 8

... FIGURE 13. PEAK PULLDOWN CURRENT vs OUTPUT VOLTAGE ( FIGURE 15. QUIESCENT CURRENT vs VOLTAGE 8 HIP2100 (Continued) 1 0.1 0.01 0.001 -4 1•10 -5 1•10 1•10 0.3 FIGURE 14. BOOTSTRAP DIODE I-V CHARACTERISTICS 120 100 FIGURE 16. V 0.4 ...

Page 9

... INDEX NX k AREA 0.10 e BOTTOM VIEW FOR EVEN TERMINAL/SIDE 9 HIP2100 L12.4x4A 12 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE SYMBOL 0. 0. E1/2 E 0. NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5M-1994. ...

Page 10

... Quad Flat No-Lead Plastic Package (QFN) Micro Lead Frame Plastic Package (MLFP) 10 HIP2100 L16.5x5 16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VHHB ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL 0. θ - NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. ...

Page 11

... The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 11 HIP2100 M8.15 (JEDEC MS-012-AA ISSUE C) 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE M ...

Page 12

... However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 12 HIP2100 M8.15C 8 LEAD NARROW BODY SMALL OUTLINE EXPOSED PAD M ...

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