aoz1022di-01 Alpha & Omega Semiconductor, aoz1022di-01 Datasheet - Page 11

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aoz1022di-01

Manufacturer Part Number
aoz1022di-01
Description
Ezbucktm 3a Synchronous Buck Regulator
Manufacturer
Alpha & Omega Semiconductor
Datasheet

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Part Number:
AOZ1022DI-01
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An easy-to-use application software which helps to
design and simulate the compensation loop can be found
at www.aosmd.com.
Thermal Management and Layout
Consideration
In the AOZ1022 buck regulator circuit, high pulsing
current flows through two circuit loops. The first loop
starts from the input capacitors, to the V
pins, to the filter inductor, to the output capacitor and
load, and then return to the input capacitor through
ground. Current flows in the first loop when the high side
switch is on. The second loop starts from inductor, to the
output capacitors and load, to the anode of Schottky
diode, to the cathode of Schottky diode. Current flows in
the second loop when the low side diode is on.
In PCB layout, minimizing the two loops area reduces the
noise of this circuit and improves efficiency. A ground
plane is strongly recommended to connect input capaci-
tor, output capacitor, and PGND pin of the AOZ1022.
In the AOZ1022 buck regulator circuit, the major power
dissipating components are the AOZ1022 and the
output inductor. The total power dissipation of converter
circuit can be measured by input power minus output
power.
The power dissipation of inductor can be approximately
calculated by output current and DCR of inductor.
The actual junction temperature can be calculated with
power dissipation in the AOZ1022 and thermal
impedance from junction to ambient.
P
T
P
Rev.3.0 November 2011
inductor_loss
junction
total_loss
=
=
P
V
=
total_loss
IN
I
O
2
I
IN
R
inductor
P
V
inductor_loss
O
I
O
1.1
IN
pin, to the LX
JA
www.aosmd.com
The maximum junction temperature of AOZ1022 is
150°C, which limits the maximum load current capability.
Please see the thermal de-rating curves for maximum
load current of the AOZ1022 under different ambient
temperature.
The thermal performance of the AOZ1022 is strongly
affected by the PCB layout. Extra care should be taken
by users during design process to ensure that the IC
will operate under the recommended environmental
conditions.
The AOZ1022 comes in an DFN 5x4 package. Layout
tips are listed below for the best electric and thermal
performance.
1. The LX pins are connected to internal PFET and
2. Do not use thermal relief connection to the V
3. Input capacitor should be connected to the V
4. A ground plane is preferred. If a ground plane is
5. Make the current trace from LX pins to L to Co to the
6. Pour copper plane on all unused board area and
7. Keep sensitive signal trace far away form the LX
NFET drains. They are low resistance thermal
conduction path and the most noisy switching node.
Connected a large copper plane to the LX pin to help
thermal dissipation.
the PGND pin. Pour a maximized copper area to the
PGND pin and the V
and the PGND pin as close as possible.
not used, separate PGND from AGND and connect
them only at one point to avoid the PGND pin noise
coupling to the AGND pin.
PGND as short as possible.
connect it to stable DC nodes, like V
pins.
IN
pin to help thermal dissipation.
AOZ1022DI-01
IN
, GND or V
Page 11 of 15
IN
IN
and
pin
OUT
.

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