vnh3sp30 STMicroelectronics, vnh3sp30 Datasheet
vnh3sp30
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vnh3sp30 Summary of contents
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... EHD (“STripFET™”) process OVERTEMPERATURE LOGIC DIAG /EN IN PWM IN DIAG / VNH3SP30 MultiPowerSO- full bridge motor driver switches are vertical MOSFETs using STMicroelectronics CLAMP B HS DRIVER CURRENT LIMITATION B OUT B DRIVER GND B ...
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... VNH3SP30 The three dice are assembled in MultiPowerSO-30 package on electrically isolated leadframes. This package, specifically designed for the harsh automotive environment offers improved thermal performance thanks to exposed Moreover, its fully symmetrical mechanical design allows superior manufacturability at board level. The input signals IN and IN ...
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... In case of short-circuit with the increase of the junction’s temperature, shuts-down the concerned High-Side to prevent its degradation and to protect the die. Signalize an abnormal behavior of the switches in the half-bridge pulling low the concerned ENx/DIAGx pin. VNH3SP30 , Brake to GND, clockwise and for the DS(on) 3/26 ...
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... OUT A IN OUT B B DIAG / DIAG / GND GND PWM GND I GND V pw VNH3SP30 Value Unit -0.3 -30 A +/- 10 mA +/- 10 mA +/- Internally Limited °C -40 to 150 °C -55 to 150 ° OUTA I OUTB ...
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... VNH3SP30 THERMAL DATA See MultiPowerSO-30 Thermal Data section. ELECTRICAL CHARACTERISTICS (V POWER Symbol Parameter V Operating supply voltage state high side resistance I ONHS R On state low side resistance ONLS R On state leg resistance ON I Supply current s High Side Free-wheeling V f Diode Forward Voltage ...
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... X X input pin 3.25V EN Normal operation 0.5 (DIAG /EN pin acts input pin) I =1mA 6 =-1mA -1.0 EN Fault operation (DIAG /EN pin acts input pin VNH3SP30 Typ Max Unit 1 +0 -3.5 -2.0 V -2.0 -0.5 V -500 A Typ Max Unit 1 ...
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... VNH3SP30 WAVEFORMS AND TRUTH TABLE TRUTH TABLE IN NORMAL OPERATING CONDITIONS In normal operating conditions the DIAG pulled high DIAG PWM pin usage: In all cases, a “0” on the PWM pin will turn-off both LSA and LSB switches. When PWM rises back to “1”, LS turn on again depending on the input pin state ...
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... DIAG /EN DIAG / Fault Information VNH3SP30 ) and one microcontroller B = pin is internally pulled down to B (1) OUT OUT A B OPEN H OPEN L OPEN H OPEN L OPEN OPEN OPEN H OPEN ...
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... VNH3SP30 TEST MODE The PWM pin allows to test the load connection between two half-bridges. In the test mode (V the internal Power Mos gate drivers are disabled. The respectively, in order to connect one side of the load at V the other side of the load allow to verify the continuity of the load connection. In case of load ...
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... OUT OUT A GND GND A B MULTI-MOTORS CONFIGURATION The can easily be designed in multi-motors driving applications such as seat VNH3SP30 positioning systems where only one motor must be driven at a time. DIAG to put unused half-bridges in high impedance. Suggested configuration is the following DIAG / ...
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... Figure 1: Definition of the delay times measurement (example of clockwise operation) V INA, V INB PWM I LOAD Figure 2: Definition of the Low Side Switching times PWM V OUTA, B 90% t DEL t DEL 80 10% 20 VNH3SP30 11/26 ...
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... VNH3SP30 Figure 3: Definition of the High side Switching times V INA, t D(on) V OUTA 90% 12/26 t D(off) t 10% t ...
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... VNH3SP30 Waveforms NORMAL OPERATION ( DIAG / DIAG / PWM OUT A OUT B (int. pin) GATE A (int. pin) GATE B DIAG NORMAL OPERATION ( DIAG / DIAG / PWM OUT A OUT B (int. pin) GATE A (int. pin) GATE B CURRENT LIMITATION/THERMAL SHUTDOWN or OUT ...
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... OUT A OUT B (int. pin)GATE A (int. pin) GATE B DIAG / DIAG / load connected shorted to V and undervoltage shutdown A CC OUT shorted to V normal operation A CC Load disconnection test (IN =1, PWM=-2V) A load disconnected VNH3SP30 undervoltage shutdown load connected back 14/26 ...
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... VNH3SP30 On State Supply Current Is (mA Vcc=18V INA or INB= -50 - 100 Tc (ºC) High Level Input Current Iinh (µ Vin=3.25V -50 - 100 Tc (ºC) Input High Level Voltage Vih (V) 3.6 3.4 3.2 3 2.8 2.6 2.4 2.2 2 -50 ...
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... Low Level Enable Voltage Venl (V) 2.8 2.6 2.4 2.2 2 1.8 1.6 1.4 1.2 1 -50 -25 125 150 175 Enable Clamp Voltage Vencl (V) 8 7.75 7.5 7.25 7 6.75 6.5 6.25 6 125 150 175 -50 -25 VNH3SP30 100 125 150 175 Tc (ºC) Vcc= 100 125 150 175 Tc (ºC) Ien=1mA 100 125 150 175 Tc (ºC) 16/26 ...
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... Current Limitation Ilim ( -50 100 125 150 175 VNH3SP30 Vcc=9V - 100 125 150 Tc (ºC) - 100 125 150 Tc (ºC) - 100 125 150 Tc (ºC) 175 ...
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... VNH3SP30 On State High Side Resistance Vs. T Ronhs (mOhm Iload=12A Vcc=9V; 13V; 18V -50 - 100 Tc (ºC) On State Low Side Resistance Vs. T Ronls (mOhm Iload=12A Vcc=9V; 13V; 18V -50 - 100 Tc (ºC) ...
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... Output Voltage Fall Time tf (µs) 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 -50 -25 125 150 175 VNH3SP30 100 125 150 175 Tc (º 100 125 150 175 Tc (ºC) 19/26 ...
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... measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm, th HIGH SIDE CHIP HS AB LOW SIDE LOW SIDE CHIP A CHIP Area (refer to PCB layout) VNH3SP30 2 ). RthA RthB = RthC RthAB = RthAC RthBC 15 20 20/26 ...
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... VNH3SP30 THERMAL CALCULATION IN CLOCKWISE AND ANTI-CLOCKWISE OPERATION IN STEADY- STATE MODE dHSA ON OFF OFF ON R thHSLS P dHSB OFF ON ON OFF R thHSLS Thermal resistances definition (values according to the PCB heatsink area High Side Chip Thermal Resistance Junction to Ambient (HS ...
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... Z thHS Z thHSLS thLS Z thLSLS VNH3SP30 Footprint Footprint Footprint ...
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... VNH3SP30 Thermal fitting model of an H-Bridge in MultiPowerSO-30 Thermal Parameter (*) 2 Area/island (cm ) R1=R7 (° C/W) R2=R8 (° C/W) R3 (° C/W) R4 (° C/W) R5 (° C/W) R6 (° C/W) R9=R10=R15=R16 (° C/W) R11=R17 (° C/W) R12=R18 (° C/W) R13=R19 (° C/W) R14=R20 (° C/W) R21=R22=R23 (° C/W) C1=C7 (W.s/° C) C2=C8 (W.s/° (W.s/°C) C4=C13=C19 (W.s/°C) C5 (W.s/°C) C6 (W.s/°C) C9=C15 (W.s/°C) C10=C11=C16=C17 (W.s/° C) C12=C18 (W.s/° C) C14=C20 (W.s/° ...
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... VNH3SP30 MultiPowerSO-30 MECHANICAL DATA DIM 24/26 2 mm. MIN. TYP 1.85 0 0.42 0.23 17.1 17.2 18.85 15 5.55 4.6 9.6 0.8 0deg MAX. 2.35 2.25 0.1 0.58 0.32 17.3 19.15 16.1 6.05 5.1 10.1 1.15 10deg 7deg ...
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... MultiPowerSO-30 SUGGESTED PAD LAY-OUT VNH3SP30 25/26 ...
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