uaa2082 NXP Semiconductors, uaa2082 Datasheet - Page 12

• Manufacturer Part Number: uaa2082
• Description: Advanced Pager Receiver
• Manufacturer: NXP Semiconductors

Philips Semiconductors
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
See Table 3 for bonding pad description and locations for x/y co-ordinates.
2000 Nov 15
handbook, full pagewidth
Advanced pager receiver
Chip area: 18.15 mm
Chip thickness: 380 20 m.
Drawing not to scale.
2
3.83
mm
25
26
27
28
1
2
3
4
Where:
y
0
Pad number 1 (diameter 124 m)
Pad 124 m x 124 m
Pad not used
Pad 100 m x 100 m
Pad 100 m x 100 m with reference point
0
24
5
Fig.7 Bonding pad locations.
6
23
UAA2082U
7
4.74 mm
22
12
8
21
9
20
10
19
MLC229
11
17
16
15
14
13
12
18
x
Product specification
UAA2082