se98pw NXP Semiconductors, se98pw Datasheet - Page 32

• Manufacturer Part Number: se98pw
• Description: Se98 So-dimm Smbus/i2c-bus Temperature Sensor
• Manufacturer: NXP Semiconductors

NXP Semiconductors
18. Contents
1
2
2.1
2.2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.3.1
7.3.2
7.4
7.5
7.6
7.7
7.8
7.9
8
8.1
8.2
8.3
8.4
8.5
8.5.1
8.5.2
8.5.3
8.6
8.7
8.8
8.9
9
9.1
9.2
9.3
10
11
12
13
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
Register descriptions . . . . . . . . . . . . . . . . . . . 11
Application design-in information . . . . . . . . . 20
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 21
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 22
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 25
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
General features . . . . . . . . . . . . . . . . . . . . . . . . 2
Temperature sensor features . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Serial bus interface . . . . . . . . . . . . . . . . . . . . . . 5
Slave address . . . . . . . . . . . . . . . . . . . . . . . . . . 5
EVENT output. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Alarm window . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Critical trip. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Conversion rate. . . . . . . . . . . . . . . . . . . . . . . . . 6
Power-up default condition . . . . . . . . . . . . . . . . 7
Device initialization . . . . . . . . . . . . . . . . . . . . . . 7
SMBus Time-out . . . . . . . . . . . . . . . . . . . . . . . . 7
SMBus Alert . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
SMBus/I
Register overview . . . . . . . . . . . . . . . . . . . . . . 11
Capability register (00h, 16-bit read-only). . . . 12
Configuration register (01h, 16-bit read/write) 13
Temperature format . . . . . . . . . . . . . . . . . . . . 16
Temperature Trip Point registers . . . . . . . . . . . 16
Upper Boundary Alarm Trip register (16-bit
read/write). . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Lower Boundary Alarm Trip register (16-bit
read/write). . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Critical Alarm Trip register (16-bit read/write) . 17
Temperature register (16-bit read-only) . . . . . 18
Manufacturer’s ID register (16-bit read-only) . 18
Device ID register . . . . . . . . . . . . . . . . . . . . . . 19
SMBus register . . . . . . . . . . . . . . . . . . . . . . . . 19
SE98 in memory module application . . . . . . . 20
Layout consideration. . . . . . . . . . . . . . . . . . . . 21
Thermal considerations . . . . . . . . . . . . . . . . . 21
2
C-bus interface . . . . . . . . . . . . . . . . . 8
13.1
13.2
13.3
13.4
14
15
16
16.1
16.2
16.3
16.4
17
18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2008.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
SO-DIMM SMBus/I
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 29
Revision history . . . . . . . . . . . . . . . . . . . . . . . 30
Legal information . . . . . . . . . . . . . . . . . . . . . . 31
Contact information . . . . . . . . . . . . . . . . . . . . 31
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Introduction to soldering. . . . . . . . . . . . . . . . . 27
Wave and reflow soldering . . . . . . . . . . . . . . . 27
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 27
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 28
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 31
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 31
2
C-bus temperature sensor
Date of release: 7 January 2008
Document identifier: SE98_2
All rights reserved.
SE98