cat6500 ON Semiconductor, cat6500 Datasheet - Page 3

• Manufacturer Part Number: cat6500
• Description: Cat6500 3.0 A Power Selector Switch
• Manufacturer: ON Semiconductor

Table 1. PIN FUNCTION DESCRIPTION
25, 26, 27, 28
6, 7, 8, 9, 10
30, 31, 32
1, 2, 3, 4
Pin No.
11, 12
13
14
15
16
17
18
19
20
21
22
23
24
29
33
34
35
36
5
SW2_STAT
SW1_STAT
PWR_OUT
PWR_OUT
PWR_OUT
PRIORITY
Pin Name
RM_EN2
RM_EN1
VCC
GND
GND
PS2
PS1
PS1
PS2
PS1
NIC
NIC
NIC
NIC
NIC
C1
–
Power Output. Must be tied to PWR_OUT on opposite side of chip. Use all 3 pins each side.
No Internal Connection. A signal or voltage applied to this pin will have no effect on device operation.
Power Source #2. External power input
No Internal Connection. A signal or voltage applied to this pin will have no effect on device operation.
Power input from battery.
Ground. Reference point for all voltages.
Filter capacitor for CAT6500’s internal power bus
No Internal Connection. A signal or voltage applied to this pin will have no effect on device operation.
No Internal Connection. A signal or voltage applied to this pin will have no effect on device operation.
Priority selects preferred power source when both PS1 and PS2 are powered.
Reverse Mode Enable 2. Overrides PRIORITY and turns SW2 ON.
Ground. Reference point for all voltages.
Reverse Mode Enable 1. Overrides PRIORITY and turns SW1 ON.
Power Source #1. External power input.
Power Source 2 Status. An open drain LOW true logic level output indicating that the switch SW2 is
turned on.
Power Source 1 Status. An open drain LOW true logic level output indicating that the switch SW1 is
turned on.
Power Source #1. External power input.
No Internal Connection. A signal or voltage applied to this pin will have no effect on device operation.
Power Output. Must be tied to PWR_OUT on opposite side of chip. Use all 3 pins each side.
Electrically active thermal pad. Does not need to be connected to other PWR_OUTs. Can be left float-
ing but must not be connected to other signal paths or Ground.
Electrically active thermal pad. Does not need to be connected to other PS2 pins. Can be left floating
but must not be connected to other signal paths or Ground.
Mechanical support for control IC. This chip does not generate any significant heat and does not need
a separate heat sinking connection. Electrically this may be left floating or can be grounded. It should
NOT be connected to other signals or voltages.
Electrically active thermal pad. Does not need to be connected to other PS1 pins. Can be left floating
but must not be connected to other signal paths or Ground.
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3
Description