bd00hc0wefj ROHM Co. Ltd., bd00hc0wefj Datasheet - Page 10

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bd00hc0wefj

Manufacturer Part Number
bd00hc0wefj
Description
1a Secondary Variable Output Ldo Regulators For Local Power Supplies
Manufacturer
ROHM Co. Ltd.
Datasheet

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(11). Regarding input pin of the IC
(12). Ground Wiring Pattern.
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a
single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by
large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of any
external components, either.
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BD00HC0WEFJ
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This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated.
P-N junctions are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example, the relation between each potential is as follows:
The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage.
Accordingly, methods by which parasitic diodes operate, such as applying a voltage that is lower than the GND (P substrate)
voltage to an input pin, should not be used.
Pin A
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
N
Parasitic diodes can occur inevitable in the structure of the IC.
P
+
N
GND
P
P substrate
P
+
N
Resistor
Pin A
Parasitic
element
Parasitic element
Pin B
N
10/11
P
+
C
B
N
E
GND
P
P substrate
Transistor (NPN)
P
+
N
GND
Other adjacent elements
Pin B
B
C
E
Technical Note
2010.04 - Rev.A
GND
Parasitic
element

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