bc846ds NXP Semiconductors, bc846ds Datasheet - Page 3

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bc846ds

Manufacturer Part Number
bc846ds
Description
65 V, 100 Ma Npn/npn General-purpose Transistor
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
6. Thermal characteristics
BC846DS_1
Product data sheet
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
Table 6.
[1]
Symbol
T
T
T
Symbol
Per transistor
R
R
Per device
R
Fig 1.
j
amb
stg
th(j-a)
th(j-sp)
th(j-a)
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
FR4 PCB, standard footprint
Per device: Power derating curve SOT457 (SC-74)
Limiting values
Thermal characteristics
Parameter
junction temperature
ambient temperature
storage temperature
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
thermal resistance from
junction to ambient
(mW)
P
tot
500
400
300
200
100
Rev. 01 — 17 July 2009
0
…continued
75
25
65 V, 100 mA NPN/NPN general-purpose transistor
Conditions
Conditions
in free air
in free air
25
75
125
[1]
[1]
T
006aab621
amb
Min
-
-
-
( C)
175
Min
-
55
65
Typ
-
-
-
BC846DS
© NXP B.V. 2009. All rights reserved.
Max
150
+150
+150
Max
500
250
328
Unit
C
C
C
Unit
K/W
K/W
K/W
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