apa3010 Anpec Electronics Corporation, apa3010 Datasheet
apa3010
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apa3010 Summary of contents
Page 1
... The APA3010 bridged-tied load (BTL) audio power amplifier developed especially for low-voltage applica- =5V tions where internal speakers. Operating with a 5V supply, DD =0.1 A the APA3010/1 can deliver 3.3W of continuous power into DD a BTL 3 frequencies. Although this device is characterized out to THD+N=0.1% 20kHz, its operation is optimized for narrow band appli- cations such as wireless communications ...
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... APA3010 XXXXX A3010/1 APA3010 Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD- 020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen free ( does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight) ...
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... P =2W =1.6W =1W Open Loop =120kHz =6dB 5V 25°C (unless otherwise noted APA3010/1 Min. Typ. Max 0.1 - 0.1 - 0.1 - 0.1 - 0.1 2.6 - 2.3 1.3 3.3 - 2.7 1.7 0.06 - 0.04 0. 380 www.anpec.com.tw ...
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... APA3010/1 Typical Operating Characteristics THD+N vs. Output Power =6dB V f =1kHz 0.1 0.01 0 0.5 1 1.5 2 Output Power (W) THD+N vs. Frequency =6dB 0.1 P =1W O 0.01 20 100 1k Frequency (Hz) THD+N vs. Output Power =6dB 20kHz 20Hz in 0 ...
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... APA3010/1 Typical Operating Characteristics (Cont.) THD+N vs. Frequency =1. 0.1 A =20dB V A =6dB V 0.01 20 100 1k Frequency (Hz) THD+N vs. Frequency =6dB 0.1 P =0.5W O 0.01 0.005 20 100 1k Frequency (Hz) Frequency Response +6 Gain +5 +4 Phase 100 1k Frequency (Hz) Copyright ANPEC Electronics Corp ...
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... APA3010/1 Typical Operating Characteristics (Cont.) Frequency Response +6 Gain +5 +4 Phase V = =0. 100 1k Frequency (Hz) PSRR vs. Frequency +0 V = -20 B -30 -40 -50 -60 -70 -80 -90 -100 20 100 1k Frequency (Hz) Output Noise Voltage vs.Frequency 100 50 LPF BW<22kHz 20 A-Weighting ...
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... APA3010/1 Typical Operating Characteristics (Cont.) Supply Current vs. Supply Voltage 8.0 A =6dB V No Load 7.0 6.0 5.0 4.0 2.5 3.0 3.5 4.0 Supply Voltage(V) Power Dissipation vs. Output Power 3 =6dB V 3 =1kHz in 2.5 BW<80kHz THD+N=10% 2.0 1.5 1.0 0.5 0.0 2.5 3.0 3.5 4.0 Supply Voltage(V) Copyright ANPEC Electronics Corp. Rev. A.6 - Jun., 2009 4.5 5.0 5.5 THD+N=1% 4.5 5.0 5.5 7 Supply Voltage vs. Output Power 4.0 V =5V ...
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... Copyright ANPEC Electronics Corp. Rev. A.6 - Jun., 2009 I/O Shutdown mode control signal input, place entire IC in shutdown mode when held I high in APA3010 (APA3011 held low). I Bypass pin. I INP is the non-inverting input. INP is typically tied to the Bypass terminal. I INN is the inverting input. INN is typically used as the audio input terminal. ...
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... APA3010/1 Typical Application Circuit For SE input signal Audio IN 20k 0.47 F 100k Shutdown Signal For Differential input signal Audio IN 20k 0. Audio IN 20k 0. Shutdown Signal Copyright ANPEC Electronics Corp. Rev. A.6 - Jun., 2009 R f 20k i 4 INN INP BYPASS ...
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... Copyright ANPEC Electronics Corp. Rev. A.6 - Jun., 2009 Input Resistance, R The gain for audio input of the APA3010/1 is set by the external resistors (R BTL Gain = -2 x OUTP BTL mode operation brings the factor the gain equation due to the inverting amplifier mirroring the volt- age swing across the load ...
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... F or greater placed near the audio power amplifier is recommended. Optimizing Depop Circuitry Circuitry has been included in the APA3010/1 to minimize the amount of popping noise at power-up and when com- ing out of shutdown mode. Popping occurs whenever a voltage step is applied to the speaker. In order to elimi- nate clicks and pops, all capacitors must be fully dis- charged before turn-on ...
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... APA3010/1 requires spe- cial attention on thermal design. (A) V ( The thermal pad on the bottom of the APA3010/1 should be soldered down to a copper pad on the circuit board. 2.00 0.55 Heat can be conducted away from the thermal pad through 2.83 0.55 the copper plane to ambient. If the copper plane is not on the top surface of the circuit board vias of 15 mil or 4 ...
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... Power Dissipation vs. Output Power graphs AMax 0.65mm 150 - 50(1.3) = 85°C The APA3010/1 is designed with a thermal shutdown pro- tection that turns the device off when the junction tem- perature surpasses 150°C to prevent damaging the IC. 0.25mm 13 ), the maximum am- D ...
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... APA3010/1 Package Information D SOP-8P D1 THERMAL PAD MIN 0.00 A2 1.25 b 0.31 c 0.17 D 4.80 D1 2.50 5. 3.80 E2 2. Note : 1. Followed from JEDEC MS-012 BA. 2. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 6 mil per side . ...
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... APA3010/1 Package Information MSOP- EXPOSED PAD MIN 0.00 A2 0.75 b 0.22 c 0.08 D 2.90 1. 4.70 2. Note: 1. Follow JEDEC MO-187 AA-T 2. Dimension “D”does not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not flash or protrusions. ...
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... APA3010/1 Carrier Tape & Reel Dimensions K0 SECTION A-A Application A H 330.0± 2.00 50 MIN. SOP- 4.0± 0.10 8.0± 0.10 Application A H 330.0± 2.00 50 MIN. MSOP- 4.00± 0.10 8.00± 0.10 Devices Per Unit Package Type SOP-8P MSOP-8P Copyright ANPEC Electronics Corp. Rev. A.6 - Jun., 2009 P0 P2 OD0 ...
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... APA3010/1 Taping Direction Information SOP-8P MSOP-8P Copyright ANPEC Electronics Corp. Rev. A.6 - Jun., 2009 USER DIRECTION OF FEED USER DIRECTION OF FEED 17 www.anpec.com.tw ...
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... APA3010/1 Classification Profile Classification Reflow Profiles Profile Feature Preheat & Soak Temperature min (T ) smin Temperature max (T ) smax Time ( smin smax s Average ramp-up rate ( smax P Liquidous temperature ( Time at liquidous ( Peak package body Temperature ( Time (t )** within the specified ...
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... APA3010/1 Classification Reflow Profiles Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package Thickness <2.5 mm 2.5 mm Table 2. Pb-free Process – Classification Temperatures (Tc) Package Thickness <1.6 mm 1.6 mm – 2.5 mm 2.5 mm Reliability Test Program Test item SOLDERABILITY HOLT PCT TCT HBM MM Latch-Up Customer Service Anpec Electronics Corp. ...