74HCT366D,653 NXP Semiconductors, 74HCT366D,653 Datasheet
74HCT366D,653
Specifications of 74HCT366D,653
74HCT366D-T
933715160653
Related parts for 74HCT366D,653
74HCT366D,653 Summary of contents
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Hex buffer/line driver; 3-state; inverting Rev. 03 — 21 November 2006 1. General description The 74HC366; 74HCT366 is a high-speed Si-gate CMOS device and is pin compatible with Low-power Schottky TTL (LSTTL). The 74HC366; 74HCT366 has six inverting ...
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... NXP Semiconductors 4. Functional diagram OE1 1 15 OE2 001aaf583 Fig 1. Functional diagram OE1 OE2 Fig 4. Logic diagram 74HC_HCT366_3 Product data sheet OE1 OE2 001aaf581 Fig 2. Logic symbol buffer/line driver buffer/line driver 2 3A buffer/line driver 3 4A buffer/line driver 4 5A buffer/line driver 5 6A buffer/line driver 6 Rev. 03 — ...
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... NXP Semiconductors 5. Pinning information 5.1 Pinning Fig 5. Pin configuration 5.2 Pin description Table 2. Pin description Symbol Pin OE1 GND OE2 74HC_HCT366_3 Product data sheet 74HC366 74HCT366 OE1 GND 8 9 001aaf580 Description output enable input 1 (active LOW) data input 1 data output 1 ...
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... NXP Semiconductors 6. Functional description [1] Table 3. Function table Control OE1 OE2 [ HIGH voltage level LOW voltage level don’t care high-impedance OFF-state. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors Table 5. Recommended operating conditions Symbol Parameter t rise time r t fall time f 74HCT366 V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t rise time r t fall time f 9. Static characteristics Table 6. Static characteristics 74HC366 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors Table 6. Static characteristics 74HC366 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter I OFF-state output current OZ I supply current CC C input capacitance +85 C amb V HIGH-level input voltage IH V LOW-level input voltage IL V HIGH-level output voltage LOW-level output voltage V ...
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... NXP Semiconductors Table 6. Static characteristics 74HC366 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter V LOW-level output voltage input leakage current I I OFF-state output current OZ I supply current CC Table 7. Static characteristics 74HCT366 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors Table 7. Static characteristics 74HCT366 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter I OFF-state output current supply current CC I additional supply current +125 C amb V HIGH-level input voltage LOW-level input voltage IL V HIGH-level output OH voltage V LOW-level output voltage V ...
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... NXP Semiconductors Table 8. Dynamic characteristics 74HC366 Voltages are referenced to GND (ground = 0 V); C Symbol Parameter t disable time dis t transition time t C power dissipation PD capacitance +85 C amb t propagation delay pd t enable time en t disable time dis t transition time +125 C amb t propagation delay pd t enable time ...
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... NXP Semiconductors Table 8. Dynamic characteristics 74HC366 Voltages are referenced to GND (ground = 0 V); C Symbol Parameter t transition time t [ the same as t and PHL PLH [ the same as t and PZH PZL [ the same as t and t . dis PHZ PLZ [ the same as t and THL TLH ...
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... NXP Semiconductors [ the same as t and THL TLH [ used to determine the dynamic power dissipation ( input frequency in MHz output frequency in MHz output load capacitance in pF supply voltage number of inputs switching sum of outputs 11. Waveforms Measurement points are given in V and V are typical output voltage drop that occur with the output load. ...
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... NXP Semiconductors Table 10. Measurement points Type Input V M 74HC366 0.5V CC 74HCT366 1.3 V PULSE GENERATOR Test data is given in Table 11. Definitions test circuit Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance Load resistor Test selection switch Fig 8. Load circuitry for measuring switching times Table 11 ...
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... NXP Semiconductors 12. Package outline SO16: plastic small outline package; 16 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP16: plastic shrink small outline package; 16 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION IEC SOT338-1 Fig 10. Package outline SOT338-1 (SSOP16) ...
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... NXP Semiconductors DIP16: plastic dual in-line package; 16 leads (300 mil); long body pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.7 0.51 3.7 inches 0.19 0.02 0.15 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...
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... NXP Semiconductors TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... Release date 74HC_HCT366_3 20061121 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors • Legal texts have been adapted to the new company name where appropriate • Added family specification 74HC_HCT366_CNV_2 ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 4 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 17 14 Revision history ...