74LVT14D,112 NXP Semiconductors, 74LVT14D,112 Datasheet
74LVT14D,112
Specifications of 74LVT14D,112
74LVT14D
935209170112
Related parts for 74LVT14D,112
74LVT14D,112 Summary of contents
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V hex inverter Schmitt trigger Rev. 02 — 25 April 2008 1. General description The 74LVT14 is a high-performance BiCMOS product designed for capable of transforming slowly changing input signals into sharply defined, jitter free ...
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... NXP Semiconductors 4. Functional diagram mna204 Fig 1. Logic symbol 5. Pinning information 5.1 Pinning 74LVT14 GND Fig 4. Pin configuration for SO14 and (T)SSOP14 74LVT14_2 Product data sheet 001aac497 Fig 2. IEC logic symbol 001aah920 Fig 5. Rev. 02 — 25 April 2008 3.3 V hex inverter Schmitt trigger ...
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... NXP Semiconductors 5.2 Pin description Table 2. Pin description Symbol Pin 11 10, 12 GND Functional description Table 3. Function selection Inputs [ HIGH voltage level LOW voltage level. 7. Limiting values [1] Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors 8. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter V supply voltage CC V input voltage I I HIGH-level output current OH I LOW-level output current OL T ambient temperature amb t/ V input transition rise and fall rate 9. Static characteristics Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Symbol Parameter t LOW to HIGH propagation delay PLH t HIGH to LOW propagation delay PHL [1] Typical values are measured at T 11. Waveforms See Table 8 for measurement points. V and V are typical output voltage levels that occur with the output load ...
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... NXP Semiconductors Table 8. Measurement points 3.6 V Test data is given in given in Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance Z T Fig 8. Load circuitry for switching times Table 9. Test data ...
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... NXP Semiconductors 12. Package outline SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors SSOP14: plastic shrink small outline package; 14 leads; body width 5 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.21 1. 0.25 0.05 1.65 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION IEC SOT337-1 Fig 10. Package outline SOT337-1 (SSOP14) ...
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... NXP Semiconductors TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2 0.85 mm terminal 1 index area terminal 1 index area DIMENSIONS (mm are the original dimensions) (1) A UNIT max. 0.05 0. 0.2 0.00 0.18 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. ...
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... Release date 74LVT14_2 20080425 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Quick reference section removed. • ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 17. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 3 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11 14 Revision history ...