p82c150 NXP Semiconductors, p82c150 Datasheet - Page 32

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p82c150

Manufacturer Part Number
p82c150
Description
Can Serial Linked I/o Device Slio With Digital And Analog Port Functions
Manufacturer
NXP Semiconductors
Datasheet

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Philips Semiconductors
12 PACKAGE OUTLINE
1996 Jun 19
SO28: plastic small outline package; 28 leads; body width 7.5 mm
CAN Serial Linked I/O device (SLIO) with
digital and analog port functions
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT136-1
28
1
Z
max.
2.65
0.10
y
A
pin 1 index
0.012
0.004
0.30
0.10
A
1
0.096
0.089
2.45
2.25
A
2
075E06
IEC
0.25
0.01
A
3
e
0.019
0.014
0.49
0.36
b
D
p
MS-013AE
0.013
0.009
0.32
0.23
JEDEC
c
0
REFERENCES
18.1
17.7
0.71
0.69
D
(1)
0.30
0.29
E
7.6
7.4
(1)
b
p
scale
0.050
EIAJ
1.27
32
5
e
15
14
w
10.65
10.00
0.42
0.39
H
M
E
c
0.055
1.4
L
A
10 mm
2
0.043
0.016
A
1.1
0.4
L
1
p
0.043
0.039
1.1
1.0
Q
H
E
PROJECTION
E
detail X
EUROPEAN
0.25
0.01
v
L
L
0.25
0.01
p
Q
Preliminary specification
w
(A )
3
0.004
0.1
y
A
P82C150
ISSUE DATE
95-01-24
91-08-13
A
0.035
0.016
Z
0.9
0.4
(1)
X
SOT136-1
v
M
8
0
A
o
o

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