NL17SZ32DFT2G ON Semiconductor, NL17SZ32DFT2G Datasheet - Page 6

• Manufacturer Part Number: NL17SZ32DFT2G
• Description: IC GATE OR SGL LOG 2INPUT SOT353
• Manufacturer: ON Semiconductor
• Series: 7SZr

Specifications of NL17SZ32DFT2G

• Logic Type: OR Gate
• Number Of Inputs: 2
• Number Of Circuits: 1
• Current - Output High, Low: 32mA, 32mA
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: SC-70-5, SC-88A, SOT-323-5, SOT-353, 5-TSSOP
• Product: OR
• Logic Family: NL17SZ
• High Level Output Current: - 32 mA
• Low Level Output Current: 32 mA
• Propagation Delay Time: 5.2 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.65 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Logical Function: OR
• Number Of Elements: 1
• Operating Supply Voltage (typ): 1.8/2.5/3.3/5V
• Operating Temp Range: -55C to 125C
• Package Type: SC-70
• Number Of Outputs: 1
• Technology: CMOS
• Mounting: Surface Mount
• Pin Count: 5
• Operating Temperature Classification: Military
• Quiescent Current: 1uA
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 1.65V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NL17SZ32DFT2GOS; NL17SZ32DFT2GOS; NL17SZ32DFT2GOSTR

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5
1
e
−X−
D
2
STYLE 1:
PIN 1. BASE 1
4
3
2. EMITTER 1/2
3. BASE 2
4. COLLECTOR 2
5. COLLECTOR 1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
b
0.08 (0.003)
−Y−
5 PL
E
*For additional information on our Pb−Free strategy and soldering
M
STYLE 2:
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
PIN 1. CATHODE
X
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
Y
0.0531
1.35
A
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Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
SOLDERING FOOTPRINT*
http://onsemi.com
0.0197
H
c
CASE 463B−01
L
E
0.0118
0.5
XV5 SUFFIX
0.3
0.0394
SOT−553
ISSUE B
1.0
0.0197
6
0.5
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
Y14.5M, 1982.
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
DIM
H
A
D
E
b
c
e
L
E
SCALE 20:1
0.0177
0.45
0.50
0.17
0.08
1.50
1.10
0.10
1.50
MIN
MILLIMETERS
0.50 BSC
NOM
0.55
0.22
0.13
1.60
1.20
0.20
1.60
inches
mm
MAX
0.60
0.27
0.18
1.70
1.30
0.30
1.70
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
0.020
0.007
0.003
0.059
0.043
0.004
0.059
MIN
0.020 BSC
INCHES
NOM
0.022
0.009
0.005
0.063
0.047
0.008
0.063
0.024
0.007
0.067
0.051
0.012
0.067
0.011
MAX
NL17SZ32/D