ppc440gx-3rf800cz Applied Micro Circuits Corporation (AMCC), ppc440gx-3rf800cz Datasheet - Page 60

• Manufacturer Part Number: ppc440gx-3rf800cz
• Description: Power Pc 440gx Embedded Processor
• Manufacturer: Applied Micro Circuits Corporation (AMCC)

440GX – Power PC 440GX Embedded Processor
60
Heat Sink Mounting Information (Ceramic Package Only)
Proper thermal design is primarily dependent upon multiple system-level effects; that is, the effects of the heat
sink, the air flow, and the thermal interface material. To reduce the die-junction temperature, heat sinks may be
attached to the package by several methods: adhesive, spring clips to the printed-circuit board or package, or a
mounting clip and screw assembly. When attaching heat sinks, it is important to avoid placing excessive
mechanical stress on bonding of the chip to the substrate and the package to the board.
Heat Sink Attached With Spring Clip
Heat Sink Attached With Adhesive
Important: All of the guidelines indicated in the above diagrams must be evaluated and adjusted to account for the
shock and vibration effects of any particular application.
Heat sink
Heat sink clip
Heat sink clip
Thermal grease
CBGA
package
Static compression (spring force)—2.27kg maximum
Printed
circuit
board
Printed
circuit
board
Adhesive
CBGA
Heat sink
package
Spring clip to package
Weight
force
Heat sink
Heat sink clip
Heat sink clip
Thermal grease
CBGA
package
Printed
circuit
board
Static compression (spring force)—2.27kg maximum
Note 1: Force is limited by allowable compression on the die.
Heat sink
Heat sink weight force—60g maximum
Printed
circuit
board
CBGA
Adhesive
package
Allowable package compression force is 4.4kg.
Spring clip to board
Revision 1.17 – July 16, 2008
Data Sheet
Weight
force
1
AMCC