tga2514-epu TriQuint Semiconductor, tga2514-epu Datasheet - Page 8

• Manufacturer Part Number: tga2514-epu
• Description: Ku-band 6.5 W Power Amplifier
• Manufacturer: TriQuint Semiconductor

TriQuint Semiconductor Texas Phone: [phone] Fax: [phone] Email: [e-mail] Web: www.triquint.com
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
1.136 (0.045)
3.903 (0.154)
3.748 (0.148)
0.148 (0.006)
0.000 (0.000)
Units: Millimeters (inches)
Chip edge to bond pad dimensions are shown to center of bond pad
Chip size +/- 0.05 (0.002)
GND IS BACKSIDE OF MMIC
Bond pad #1
Bond pads #2, 8
Bond pads #3, 7
Bond pads # 4, 6
Bond pad #5
Thickness: 0.100 (0.004) (reference only)
1
Mechanical Drawing
2
8
RF Input
RF Output
Vg
Vd
Vd
3
7
Advance Product Information
0.096 x 0.200 (0.004 x 0.008)
0.098 x 0.098 (0.004 x 0.004)
0.198 x 0.100 (0.008 x 0.004)
0.296 x 0.178 (0.012 x 0.007)
0.096 x 0.200 (0.004 x 0.008)
6
4
5
0.161 (0.006)
3.742 (0.147)
2.764 (0.109)
November 9, 2004
TGA2514-EPU
8