tga2602-sm TriQuint Semiconductor, tga2602-sm Datasheet - Page 21

• Manufacturer Part Number: tga2602-sm
• Description: Dc - 3000 Mhz High Ip3 Dual Phemt
• Manufacturer: TriQuint Semiconductor

TriQuint Semiconductor Texas Phone: [phone] Fax: [phone] Email: [e-mail] Web: www.triquint.com
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Proper ESD precautions must be followed while handling packages.
Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven
vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed
in the table below.
Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement.
The volume of solder paste depends on PCB and component layout and should be well controlled to
ensure consistent mechanical and electrical performance. This package has little tendency to self-align
during reflow .
Clean the assembly with alcohol.
Time above Melting Point
Time within 5 C of Peak
Max Peak Temperature
Activation Time and
Reflow Profile
Ramp-down Rate
Ramp-up Rate
Temperature
Temperature
Recommended Surface Mount Package Assembly
TGA2602-SM
Part
Ordering Information
Typical Solder Reflow Profiles
60 – 120 sec @ 140 – 160 C
60 – 150 sec
4 – 6 C/sec
10 – 20 sec
3 C/sec
SnPb
240 C
2x2 6 Lead QFN
Package Style
Advance Product Information
60 – 180 sec @ 150 – 200 C
60 – 150 sec
4 – 6 C/sec
10 – 20 sec
Pb Free
3 C/sec
260 C
TGA2602-SM
May 24, 2006
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