cxm3512eq Sony Electronics, cxm3512eq Datasheet

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cxm3512eq

Manufacturer Part Number
cxm3512eq
Description
Sp9t Gsm/umts Dual Mode Antenna Switch
Manufacturer
Sony Electronics
Datasheet

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SP9T GSM/UMTS Dual Mode Antenna Switch
Description
Features
Package
Structure
The CXM3512EQ is one of a range of low insertion loss, high linearity, low IMD and high power MMIC antenna
switch modules for GSM/UMTS or CDMA dual-mode handsets.
The Sony L.F.M.* contains SP9T switch die, CMOS decoder and a dual-LPF on GSM transmit paths for
suppression of transmitter harmonics.
Excellent insertion loss contributes to the good sensitivity and longer talk time. This switch also provides
excellent ESD performance.
* L.F.M. = Lead Frame Module
(Applications: GSM (4 bands) / UMTS (3 bands, class I-VI) or CDMA (2 bands) dual-mode handset)
Small package size: 30-pin LQFN (4.4 × 4.0 × 1.3mm)
GaAs Junction-gate PHEMT SW, CMOS decoder and dual-LPF
Sony PHEMT GaAs process is utilized for low insertion loss.
This IC is ESD sensitive device. Special handling precautions are required.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license
by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating
the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
Low insertion loss
Built-in dual-LPF
TRXs and RXs paths are changeable for band assignment.
4 CMOS compatible control lines
Low voltage operation (V
Lead-free and RoHS compliant
0.80dB (typ.) on TX1 (915MHz)
0.95dB (typ.) on TX2 (1910MHz)
0.65dB (typ.) on RX (960MHz)
0.65dB (typ.) on TRx (1980MHz)
Att –30dB (typ.) @2fo (Tx1 path)
Att –30dB (typ.) @2fo (Tx2 path)
DD
= 2.5V)
- 1 -
CXM3512EQ
E06X09A74

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cxm3512eq Summary of contents

Page 1

... SP9T GSM/UMTS Dual Mode Antenna Switch Description The CXM3512EQ is one of a range of low insertion loss, high linearity, low IMD and high power MMIC antenna switch modules for GSM/UMTS or CDMA dual-mode handsets. The Sony L.F.M.* contains SP9T switch die, CMOS decoder and a dual-LPF on GSM transmit paths for suppression of transmitter harmonics ...

Page 2

Absolute Maximum Ratings ° ( Bias voltage Control voltage (CTL-A/B/C/D) Operating temperature Storage temperature Vctl 4 V ° Topr –20 to +90 C ° Tstg –65 to +150 ...

Page 3

Block Diagram Ant F1 F2 F11 F12 LPF1 LPF2 Tx1 Tx2 Note) Built-in SW control circuit Pin Configuration 13 GND 14 GND GND 17 Rx4 18 Rx3 19 Rx2 20 Rx1 21 GND 22 GND 23 24 ...

Page 4

Pin Description Pin No. 1 TRx1 2 GND 3 TRx2 4 TRx3 5 GND 6 ANT 7 GND GND 10 GND 11 Tx2 (DCS/PCS) 12 GND 13 Tx1 (GSM850/900M) 14 GND 15 GND Truth Table Vctl state ...

Page 5

Electrical Characteristics (V = 2.5V, Vctl = 2.5V Item Symbol Tx1 – Ant Tx2 – Ant Ant – TRx1 (Tx) Ant – TRx2 (Tx) Ant – TRx3 (Tx) Ant – Rx1 Insertion IL loss Ant – ...

Page 6

Vctl = 2.5V Item Symbol TX Path Activated Active path: TX1 – Ant TX1 – RX1 TX1 – RX2 TX1 – RX3 TX1 – RX4 TX1 – TX2 TX1 – TRX1 TX1 – ...

Page 7

Item Symbol Active path: TRX3 – Ant TRX3 – RX1 TRX3 – RX2 TRX3 – RX3 ISO. TRX3 – RX4 TRX3 – TX1 TRX3 – TX2 TRX3 – TRX1 TRX3 – TRX2 RX Path Activated Active path: Ant – RX1 ...

Page 8

Vctl = 2.5V Item Band fcw1 = 1950MHz, Pcw1 = +20dBm IMT fcw2 = 190MHz, Pcw2 = –15dBm fcw1 = 1880MHz, Pcw1 = +20dBm PCS fcw2 = 80MHz, Pcw2 = –15dBm IIP2 fcw1 ...

Page 9

Supply voltage ° ( Item Bias voltage ( Logic value ° ( Item Control voltage (CTL-A/B/C) Current consumption ° ( Item Bias current Control current Min. Typ. Max. 2.5 ...

Page 10

... RX1 C10 ∗ ∗ 1 ∗ 2 ∗ 56pF 13 12 GND GND NC GND Rx4 IC CXM3512EQ Rx3 Rx2 Rx1 GND GND C11 C12 C13 C14 C15 100pF 100pF 100pF 100pF 100pF Capacitors are required on all RF ports for DC blocking. ...

Page 11

... C9 ∗ C10 ∗ ∗ 1 ∗ 2 ∗ 56pF 13 12 GND GND NC GND Rx4 IC CXM3512EQ Rx3 Rx2 Rx1 GND GND C11 C12 C13 C14 C15 100pF 100pF 100pF 100pF 100pF DC blocking capacitors are required on all RF ports. Recommended capacitance is as follows. ...

Page 12

Pad Design (Unit: mm) : Land area GND Pads Detail-A 0.3 0.2 0.1 0.15 0.4 : Mask open area : Board resist open area PKG Outline (4.4mm) 0.95 0. Detail-B R0.05 PKG Outline R0.05 0.6 0.85 PKG Outline ...

Page 13

Package Outline (Unit: mm) LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS - 13 - SPEC. COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18μm Sony Corporation ...

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