mf1s7001xdud NXP Semiconductors, mf1s7001xdud Datasheet - Page 37

• Manufacturer Part Number: mf1s7001xdud
• Description: Mifare Classic 4k - Mainstream Contactless Smart Card Ic
• Manufacturer: NXP Semiconductors

NXP Semiconductors
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
19. Contact information
For more information, please visit:
For sales office addresses, please send an email to:
MF1S70YYX
Product data sheet
COMPANY PUBLIC
http://www.nxp.com
All information provided in this document is subject to legal disclaimers.
Rev. 3.0 — 2 May 2011
MIFARE Classic 4K - Mainstream contactless smart card IC
[e-mail]
196430
Bare die — All die are tested on compliance with their related technical
specifications as stated in this data sheet up to the point of wafer sawing and
are handled in accordance with the NXP Semiconductors storage and
transportation conditions. If there are data sheet limits not guaranteed, these
will be separately indicated in the data sheet. There are no post-packing tests
performed on individual die or wafers.
NXP Semiconductors has no control of third party procedures in the sawing,
handling, packing or assembly of the die. Accordingly, NXP Semiconductors
assumes no liability for device functionality or performance of the die or
systems after third party sawing, handling, packing or assembly of the die. It
is the responsibility of the customer to test and qualify their application in
which the die is used.
All die sales are conditioned upon and subject to the customer entering into a
written die sale agreement with NXP Semiconductors through its legal
department.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
MIFARE — is a trademark of NXP B.V.
MF1S70yyX
© NXP B.V. 2011. All rights reserved.
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