GTL2008 Philips Semiconductors (Acquired by NXP), GTL2008 Datasheet - Page 15

• Manufacturer Part Number: GTL2008
• Manufacturer: Philips Semiconductors (Acquired by NXP)

Philips Semiconductors
14. Package outline
Fig 16. Package outline SOT361-1 (TSSOP28)
GTL2008_GTL2107_2
Product data sheet
TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT361-1
max.
1.1
A
28
1
Z
y
0.15
0.05
A
1
pin 1 index
0.95
0.80
A
2
IEC
0.25
A
3
e
D
0.30
0.19
b
p
GTL translator with power good control and high-impedance outputs
MO-153
JEDEC
0.2
0.1
c
Rev. 02 — 26 September 2006
REFERENCES
D
9.8
9.6
0
(1)
b
p
E
4.5
4.3
(2)
15
14
w
JEITA
scale
0.65
2.5
M
e
H
6.6
6.2
E
c
5 mm
A
L
1
2
A
1
GTL2008; GTL2107
0.75
0.50
L
p
0.4
0.3
Q
H
E
E
detail X
PROJECTION
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
EUROPEAN
0.2
v
L
L
p
0.13
w
Q
A
(A )
0.1
3
y
ISSUE DATE
X
99-12-27
03-02-19
v
Z
0.8
0.5
A
M
(1)
SOT361-1
A
8
0
o
o
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