rf2126 RF Micro Devices, rf2126 Datasheet - Page 4

• Manufacturer Part Number: rf2126
• Description: High Power Linear Amplifier Rf2126
• Manufacturer: RF Micro Devices

2
RF2126
2-6
Base
Pkg
Pin
1
2
3
4
5
6
7
8
Function
RF OUT
RF OUT
RF OUT
RF OUT
RF IN
RF IN
GND
VCC
PC
Description
RF input. This input is DC coupled, so an external blocking capacitor is
required if this pin is connected to a DC path. An optimum match to 50Ω is
obtained by providing an external series capacitor of 1.8pF and then a
shunt capacitor of 1.3pF; see the Application Schematic. Those values are
typical for 2450MHz; other values may be required for other frequencies.
Same as pin 1.
Power control pin. For obtaining maximum performance the voltage on this
pin can be used to set correct bias level. In a typical application this is
implemented by a feedback loop. The feedback can be based on the actual
supply current of the device, i.e. maintaining a fixed current level, or it can
be based on the RF output power level to maintain a fixed RF power level
(Automatic Level Control loop). A voltage of 0.5V or lower brings the part
into power down state.
Power supply pin for the bias circuits. External low frequency bypass capac-
itors should be connected if no other low frequency decoupling is nearby.
RF output and bias for the output stage. The power supply for the output
transistor needs to be supplied to this pin. This can be done through a
quarter-wavelength microstrip line that is RF grounded at the other end, or
through an RF inductor that supports the required DC currents. Optimum
load impedance is achieved by providing a shunt capacitor of 1.8pF and a
series capacitor of 3.3pF; see the Application Schematic. Those values are
typical for 2450MHz; other values may be required for other frequencies.
Since there are several output pins available, which are internally con-
nected, one pin can be used for connecting the bias, another for connect-
ing a (third) harmonic trap filter, and the other pins for the RF output.
Same as pin 5.
Same as pin 5.
Same as pin 5.
Ground connection. The backside of the package should be connected to
the ground plane through a short path, i.e., vias under the device may be
required.
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0.196
0.189
0.123
0.107
Shaded lead is pin 1.
0.157
0.150
0.244
0.230
0.087
0.071
Package Drawing
EXPOSED
HEATSINK
0.0192
0.0138
8° MAX
0° MIN
0.050
0.065
0.055
0.035
0.016
0.004
0.002
-A-
0.0098
0.0075
Interface Schematic
Rev A14 DS070511