SKT10-3 SEMIKRON [Semikron International], SKT10-3 Datasheet
SKT10-3
Manufacturer Part Number
SKT10-3
Description
THYRISTOR
Manufacturer
SEMIKRON [Semikron International]
Datasheet
1.SKT10-3.pdf
(2 pages)
SKT 10,3 Qu ZG bond.
I
V
Size: 10,3 mm x 10,3 mm
Central gate
SKT 10,3 Qu ZG bond.
Features
• high current density due to double
• high surge current
• compatible to thick wire bonding
• compatible to all standard solder
Typical Applications*
• conrolled rectifier circuits
• solid state relays
© by SEMIKRON
T(DC)
THYRISTOR
RRM
mesa technology
processes
= 125 A
= 1600 V
SKT
Absolute Maximum Ratings
Symbol
V
V
I
I
i
T
Electrical Characteristics
Symbol
V
V
r
I
V
I
V
I
I
Dynamic Characteristics
Symbol
t
(di/dt)
(dv/dt)
Thermal Characteristics
Symbol
T
T
T
R
Mechanical Characteristics
Symbol
Raster
size
Area total
Anode
Gate and
Cathode
Wire bond
Package
Chips /
Package
2
T(AV)
TSM
T
GT
GD
H
L
q
t
jmax
j
stg
solder
RRM
DRM
T
T(TO)
GT
GD
th(j-c)
cr
cr
Rev. 1 – 19.02.2010
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
T
Conditions
Conditions
Conditions
Conditions
Semipack 1 assembly
Conditions
j
j
c
j
j
j
j
j
j
j
j
j
j
j
j
j
j
= 25 °C, I
= 25 °C, I
= 130 °C, 10 ms, sin 180°
= 130 °C, 10 ms, sin 180°
= 130 °C, I
= 130 °C
= 130 °C
= 25 °C
= 25 °C
= 115 °C
= 130 °C
= 25 °C
= 25 °C
= 130 °C
= 130 °C
= 130 °C
= 80 °C, T
R
D
j
T
= 0.2 mA
= 0.2 mA
= 130 °C
= 105 A
min.
min.
min.
0.25
-40
-40
6
Al,diameter ≤ 500µm
solderable (Ag/Ni)
bondable (Al)
10.3 x 10.3
Values
Values
106.1
1600
1600
1250
7810
typ.
typ.
typ.
0.31
130
150
tray
95
49
max.
max.
max.
1000
0.85
1.98
100
220
550
100
130
130
255
1.2
3.4
Unit
Unit
Unit
Unit
Unit
mm
A/µs
V/µs
mm
K/W
A
mΩ
mA
mA
mA
mA
pcs
°C
°C
°C
°C
µs
V
V
A
A
V
V
V
V
2
s
2
2
1
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SKT10-3 Summary of contents
Page 1
SKT 10 bond. THYRISTOR I = 125 A T(DC 1600 V RRM Size: 10 10,3 mm Central gate SKT 10 bond. Features • high current density due to double mesa technology • ...
Page 2
SKT 10 bond. This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested ...