UPD7759C NEC [NEC], UPD7759C Datasheet - Page 17

• Manufacturer Part Number: UPD7759C
• Description: ADPCM SPEECH SYNTHESIZER LSIs
• Manufacturer: NEC [NEC]

4. RECOMMENDED SOLDERING CONDITIONS
with our sales offices in case other soldering process is used, or in case soldering is done under
different conditions.
MANUAL" (IEI-1207).
Wave Soldering
Infrared Ray Reflow
VPS
Partial Heating Method
Caution Do not apply more than one soldering method at any one time, except for "Partial heating method".
Wave Soldering
(only lead part)
Partial Heating Method
Caution Do not jet molten solder on the surface of package.
The following conditions (see tables below) must be met when soldering the PD7759. Please consult
For more details, refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY
TYPE OF SURFACE MOUNT DEVICE
TYPE OF THROUGH HOLE DEVICE
PD7759GC-3BH:52-pin plastic QFP ( 14 mm)
PD7759C:40-pin plastic DIP (600mil)
Soldering Process
Soldering Process
Flow time: 10 seconds or below
Solder temperature: 260 C or below,
Flow time: 10 seconds or below,
Temperature of pre-heat: 120 C or below (Plastic surface temperature),
Number of flow process: 1
Peak package's surface temperature: 230 C or below,
Reflow time: 30 seconds or below (210 C or higher),
Number of reflow process: 1
Peak package's temperature: 215 C or below,
Reflow time: 40 seconds or below (200 C or higher),
Number of reflow process: 1
Terminal temperature: 300 C or below,
Time: 3 seconds or below (Per one side of the device)
Solder Temperature: 260 C or below
Terminal temperature: 260 C or below
Time: 10 seconds or below
Soldering Conditions
Soldering Conditions
PD7759
WS60-00-1
VP15-00-1
IR30-00-1
Symbol
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