N02L63W3AB5I ONSEMI [ON Semiconductor], N02L63W3AB5I Datasheet - Page 10

• Manufacturer Part Number: N02L63W3AB5I
• Manufacturer: ONSEMI [ON Semiconductor]

N02L63W3A
Ball Grid Array Package
Dimensions (mm)
A1 BALL PAD
CORNER (3)
6±0.10
D
K TYP
8±0.10
E
J TYP
0.375
TOP VIEW
BOTTOM VIEW
SD
D
0.375
SD
SE
Rev. 15 | Page 10 of 11 | www.onsemi.com
e = 0.75
e
A1 BALL PAD
CORNER
1.125
E
SE
e
J
1.24±0.10
1.375
K
1. DIMENSION IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER.
PARALLEL TO PRIMARY Z.
2. PRIMARY DATUM Z AND SEATING
PLANE ARE DEFINED BY THE
SPHERICAL CROWNS OF THE
SOLDER BALLS.
3. A1 BALL PAD CORNER I.D. TO BE
MARKED BY INK.
0.28±0.05
SIDE VIEW
MATRIX
BALL
TYPE
FULL
2. SEATING PLANE - Z
1. 0.35±0.05 DIA.
0.15
0.05
Z
Z