HLMP-AD61 AVAGO [AVAGO TECHNOLOGIES LIMITED], HLMP-AD61 Datasheet - Page 9

• Manufacturer Part Number: HLMP-AD61
• Description: Precision Optical Performance Red, Green and Blue 5mm Mini Oval LEDs
• Manufacturer: AVAGO [AVAGO TECHNOLOGIES LIMITED]

Precautions
Lead Forming:
• • • • • The leads of an LED lamp may be preformed or cut
• • • • • If lead forming is required before soldering, care must
• • • • • For better control, it is recommended to use proper
Soldering Condition:
• • • • • Care must be taken during PCB assembly and solder-
• • • • • The closest manual soldering distance of the
• • • • • Recommended soldering condition:
• • • • • Wave soldering parameter must be set and maintain
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to length prior to insertion and soldering into PC
board.
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads of
LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling
to the LED chip die attach and wirebond.
tool to precisely form and cut the leads to length
rather that doing it manually.
ing process to prevent damage to LED component.
soldering heat source (soldering iron’s tip) to the
body is 1.59mm. Soldering the LED closer than
1.59mm might damage the LED.
according to recommended temperature and dwell
time in the solder wave. Customer is advised to daily
check on the soldering profile to ensure the soldering
profile used is always conforming to recommended
soldering condition.
Note:
1. PCB with different size and design (component density) will
2. Avago Technologies’ high brightness LED are using high
Pre-heat temperature
Preheat time
Peak temperature
Dwell time
have different heat mass (heat capacity). This might cause a
change in temperature experienced by the board if same wave
soldering setting is used. So, it is recommended to re-calibrate
the soldering profile again prior to loading a new type of PCB.
efficiency LED die with single wire bond as shown below.
Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature is
not exceeding recommendation of 250 ° C. Over-stressing the
LED during soldering process might cause premature failure
to the LED due to delamination.
105 °C Max.
Wave
Soldering
30 sec Max
250 °C Max.
3 sec Max.
1.59mm
Manual Solder
Dipping
260 °C Max.
5 sec Max
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Avago Technologies LED configuration
• • • • • If necessary, use fixture to hold the LED component
• • • • • At elevated temperature, the LED is more
• • • • • Special attention must be given to board fabrication,
• • • • • Recommended PC board plated through holes size
Note: Electrical connection between bottom surface of LED die
and the leadframe material through conductive paste or solder.
in proper orientation with respect to the PCB during
soldering process.
Note: In order to further assist customer in designing jig
accurately that fit Avago Technologies’ product, 3D model of the
product is available upon request.
susceptible to mechanical stress. Therefore, PCB
must be allowed to cool down to room temperature
prior to handling, which includes removal of jigs,
fixtures or pallet.
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
for LED component leads.
Note: Refer to application note AN1027 for more information
on soldering LED components.
LED component
Lead size
(0.018 x 0.018inch)
(0.020 x 0.020inch)
0.457 x 0.457mm
0.508 x 0.508mm
AlInGaP Device
Diagonal
(0.025 inch)
(0.028 inch)
0.646 mm
0.718 mm
Plated through
(0.038 to 0.042 inch)
1.049 to 1.150mm
(0.041 to 0.045 inch)
hole diameter
0.976 to 1.078 mm
InGaN Device