PCF2113AU/10/F4 NXP [NXP Semiconductors], PCF2113AU/10/F4 Datasheet
PCF2113AU/10/F4
Related parts for PCF2113AU/10/F4
PCF2113AU/10/F4 Summary of contents
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PCF2113x LCD controllers/drivers Rev. 04 — 4 March 2008 1. General description The PCF2113x is a low-power CMOS LCD controller and driver, designed to drive a dot matrix LCD display of 2 lines of 12 characters or 1 line of ...
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... LCD outputs is reduced. In most applications it is possible to use V 3. Applications I Telecom equipment I Point-of-sale terminals I Portable instruments 4. Ordering information Table 1. Type number PCF2113AU/10/F4 - PCF2113DU/F4 PCF2113DH/4 PCF2113DU/2/F4 PCF2113EU/2/F4 PCF2113WU/2/F4 5. Marking Table 2. Type number PCF2113DH/4 PCF2113_FAM_4 Product data sheet ...
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NXP Semiconductors 6. Block diagram BIAS V VOLTAGE LCDIN GENERATOR V LCDSENSE V LCD V LCDOUT GENERATOR V DD3 V DD1 V CHARACTER DD2 GENERATOR RAM (128 16 CHARACTERS V SS1 V SS2 DATA REGISTER (DR) ...
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NXP Semiconductors 7. Pinning information 7.1 Pinning V 1 DD1 OSC SS1 V 6 SS2 V 7 LCDOUT V 8 LCDIN R10 R11 11 R12 12 13 R13 14 R14 ...
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NXP Semiconductors 84 dummy pad R17 96 SCL 97 SDA 100 R/W ...
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NXP Semiconductors Table 3. Pin Table 4. Pad Type Bump dimensions Height difference in one die Convex deformation Pad size (aluminium) ...
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NXP Semiconductors Table 5. Pin and bonding pad description All x/y coordinates represent the position of the center of each pad with respect to the center (x the chip (see Figure 3). Symbol Pin Type V 6 ...
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NXP Semiconductors Table 5. Pin and bonding pad description All x/y coordinates represent the position of the center of each pad with respect to the center (x the chip (see Figure 3). Symbol Pin Type C36 42 ...
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NXP Semiconductors Table 5. Pin and bonding pad description All x/y coordinates represent the position of the center of each pad with respect to the center (x the chip (see Figure 3). Symbol Pin Type C1 77 ...
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NXP Semiconductors 8. Functional description 8.1 LCD supply voltage generator The LCD supply voltage (V controlled by two internal 6-bit registers: VA and VB. program these registers. The nominal LCD operating voltage at room temperature is given by the relationship: ...
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NXP Semiconductors Table 6. Multiplex rate 1:18 1:9 1:2 [1] The values in the table are given relative to V 8.3 Oscillator The on-chip oscillator provides the clock signal for the display system. No external components are required and the ...
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NXP Semiconductors 8.8 Address counter The Address Counter (AC) assigns addresses to the DDRAM and CGRAM for reading and writing and is set by the commands ‘set DDRAM address’ and ‘set CGRAM address’. After a read/write operation the address counter ...
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NXP Semiconductors Fig 6. Table 7. Mode Address space Read/write wrap-around (moves to next line) Display shift wrap-around (stays within line) 8.10 Character generator ROM The Character Generator ROM (CGROM) generates 240 character patterns format from 8-bit ...
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NXP Semiconductors upper 4 bits 0000 0001 0010 lower 4 bits xxxx 0000 1 2 xxxx 0001 xxxx 0010 3 xxxx 0011 4 xxxx 0100 5 xxxx 0101 6 xxxx 0110 7 xxxx 0111 8 xxxx 1000 9 xxxx 1001 ...
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NXP Semiconductors upper 4 bits 0000 0001 0010 lower 4 bits xxxx 0000 1 xxxx 0001 2 xxxx 0010 3 xxxx 0011 4 xxxx 0100 5 xxxx 0101 6 xxxx 0110 7 xxxx 0111 8 xxxx 1000 9 xxxx 1001 ...
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NXP Semiconductors upper 4 bits 0000 0001 0010 lower 4 bits xxxx 0000 1 xxxx 0001 2 xxxx 0010 3 xxxx 0011 4 xxxx 0100 5 xxxx 0101 6 xxxx 0110 7 xxxx 0111 8 xxxx 1000 9 xxxx 1001 ...
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NXP Semiconductors upper 4 bits 0000 0001 0010 lower 4 bits xxxx 0000 1 xxxx 0001 2 xxxx 0010 3 xxxx 0011 4 xxxx 0100 5 xxxx 0101 6 xxxx 0110 7 xxxx 0111 8 xxxx 1000 9 xxxx 1001 ...
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NXP Semiconductors 8.11 Character generator RAM user-defined characters may be stored in the Character Generator RAM (CGRAM). Some CGRAM characters (see icons (6 if icons blink and both icon rows are used in the application ...
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NXP Semiconductors Fig 12. Cursor and blink display examples Fig 13. Example of a display with icons 8.13 Timing generator The timing generator produces the various signals required to drive the internal circuitry. Internal chip operation is not disturbed by ...
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NXP Semiconductors V LCD ROW LCD ROW LCD ROW ...
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NXP Semiconductors V LCD ROW LCD ROW LCD ROW ...
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NXP Semiconductors V LCD ROW 17 2/3 1 LCD 2/3 ROW 18 1 LCD ROW 2/3 1 LCD 2/3 COL 1 ON/OFF 1 LCD 2/3 ...
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NXP Semiconductors V oper 2/3V oper 1/3V oper state 1 COL 1 0 ROW 17 1/3V oper 2/3V oper V oper V oper 2/3V oper 1/3V state 2 oper COL 2 0 ROW 17 1/3V oper 2/3V oper V oper ...
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NXP Semiconductors Table 8. Step Instructions Only two PCF2113x registers, the Instruction Register (IR) and the Data Register (DR), can be directly controlled by the microcontroller. Before internal ...
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NXP Semiconductors There are 4 types of instructions: • Designate PCF2113x functions such as display format, data length • Set internal RAM addresses • Perform data transfer with internal RAM • Other functions In normal use, data transfer instructions are ...
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NXP Semiconductors Table 10. Instruction set with parallel bus commands Instruction Control and command bits RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 Entry mode set Display control Cursor/display ...
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NXP Semiconductors Table 11. Bit (no impact I S/C R/L L (no impact ...
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NXP Semiconductors 9.2 Return home ‘Return home’ sets the DDRAM address counter to 0 and returns the display to its original position if it was shifted. DDRAM contents do not change. The cursor or blink position goes to the left ...
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NXP Semiconductors 9.4.3 Bit B The character indicated by the cursor blinks when The cursor character blink is displayed by switching between display characters and all dots on with a period of approximately 1 s, with The ...
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NXP Semiconductors Remark: the CGRAM address uses the same address register as the DDRAM address and consists of 7 bits (A6h to A0h). With the ‘set CGRAM address’ command, only bits DB5 to DB0 are set. Bit DB6 can be ...
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NXP Semiconductors 10. Extended function set instructions and features 10.1 New instructions sets the chip into Extended instruction set mode. 10.2 Icon control The PCF2113x can drive up to 120 icons. See icon mapping. Fig 18. CGRAM ...
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NXP Semiconductors icon no. phase ROW/COL 1-5 even 17/1-5 6-10 even 17/6-10 11-15 even 17/11-15 56-60 even 17/56-60 61-65 even 18/1-5 116-120 even 18/56-60 1-5 odd (blink) 17/1-5 116-120 odd (blink) 18/56-60 CGRAM data bit = logic 1 turns the ...
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NXP Semiconductors Icon states for the even phase are stored in CGRAM characters used (see Icon states for the odd phase are stored in CGRAM characters (another 120 bits for the 120 ...
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NXP Semiconductors 10.8 Display configuration 10.8.1 Bit P The P bit is used to flip the display left to right by mirroring the column data, as shown in Figure 20. This allows the display to be viewed from behind instead ...
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NXP Semiconductors 10.9 Temperature control Default is bit TC1 = 0 and bit TC2 = 0. Selects the default temperature coefficient for the internally generated V Table 15. Bit TC1 10.10 Set V LCD The V ...
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NXP Semiconductors 11. Interfaces to microcontroller 11.1 Parallel interface The PCF2113x can send data in either two 4-bit operations or one 8-bit operation and can thus interface to 4-bit or 8-bit microcontrollers. In 8-bit mode data is transferred as 8-bit ...
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NXP Semiconductors RS R/W E internal DB7 IR7 instruction IR7, IR3: instruction 7th, 3rd bit. AC3: address counter 3rd bit. D7, D3: data 7th, 3rd bit. Fig 23. Example of 4-bit data transfer timing sequence RS R/W E internal data ...
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NXP Semiconductors Also a master receiver must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges must pull-down the SDA line during the acknowledge clock pulse, so ...
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NXP Semiconductors acknowledgement slave address R (1) Last data byte is a dummy byte (may be omitted). Fig 26. Master reads after setting word ...
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NXP Semiconductors Fig 29. Bit transfer SDA SCL Fig 30. Definition of START and STOP conditions by transmitter Fig 31. Acknowledgement on the I 11.2.2 Definitions • Transmitter: the device that sends the data to the bus • Receiver: the ...
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NXP Semiconductors 12. Internal circuitry Table 17. Symbol V DD1 V DD2 V DD3 V SS1 V SS2 V LCDSENSE V LCDIN V LCDOUT SCL SDA PCF2113_FAM_4 Product data sheet Device protection circuits Pad Internal circuit 1 109 110 7 ...
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NXP Semiconductors Table 17. Symbol OSC R/W DB0 to DB7 R16 R17 R18 C27 C28 to C52 C53 to C60 13. Limiting values Table ...
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NXP Semiconductors [1] HBM: Human Body Model, according to JESD22-A114. [2] MM: Machine Model, according to JESD22-A115. [3] CDM: Charged-Device Model, according to JESD22-C101. [4] Latch-up testing, according to JESD78. 14. Static characteristics Table 19. Static characteristics V = 1.8 ...
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NXP Semiconductors Table 19. Static characteristics DD1 DD2 DD3 unless otherwise specified. Symbol Parameter Pins DB7 to DB0 I LOW-level output OL current I HIGH-level output OH current I pull-up ...
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NXP Semiconductors 15. Dynamic characteristics Table 20. Dynamic characteristics DD1 DD2 DD3 unless otherwise specified Symbol Parameter f LCD frame frequency fr(LCD) f oscillator frequency osc f external oscillator frequency ...
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NXP Semiconductors Table 20. Dynamic characteristics DD1 DD2 DD3 unless otherwise specified Symbol Parameter t set-up time for STOP condition SU;STO t pulse width of spikes that must SP be ...
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NXP Semiconductors SDA SCL SDA Fig 34. I 16. Application information 16.1 Application diagrams Fig 35. Direct connection to 8-bit microcontroller; 4-bit bus Fig 36. Direct connection to 8-bit microcontroller; 8-bit bus PCF2113_FAM_4 Product data sheet t t BUF LOW ...
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NXP Semiconductors Fig 37. Typical application using parallel interface V SCL SDA Fig 38. Application using I PCF2113_FAM_4 Product data sheet OSC PCF2113x 470 V LCD nF 100 DB7 to ...
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NXP Semiconductors 16.2 General application information The required minimum value for the external capacitors in an application with the PCF2113x are Higher capacitor values are recommended for ripple reduction. SS For COG applications the recommended Indium Tin ...
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NXP Semiconductors when combined with display shift operation. Since the display shift operation changes display position only and the DDRAM contents remain unchanged, display data entered first can be displayed when the ‘return home’ operation is performed. Table 22. 8-bit ...
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NXP Semiconductors Table 22. 8-bit operation, 1-line display example; using internal reset (character set ‘A’) Step Instruction RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 25 cursor/display shift ‘write data’ to CGRAM/DDRAM 1 ...
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NXP Semiconductors Table 23. 8-bit operation, 1-line display and icon example; using internal reset (character set ‘A’) Step Instruction RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 15 ‘write data’ to CGRAM/DDRAM ‘write ...
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NXP Semiconductors Table 24. 8-bit operation, 2-line display example; using internal reset Step Instruction RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 13 ‘write data’ to CGRAM/DDRAM ‘write data’ to ...
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NXP Semiconductors 2 Table 25. Example of I C-bus operation; 1-line display (using internal reset, assuming SA0 = V 2 Step I C-bus byte C-bus start 8 slave address for write SA6 SA5 SA4 SA3 SA2 SA1 ...
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NXP Semiconductors 2 Table 25. Example of I C-bus operation; 1-line display (using internal reset, assuming SA0 = V 2 Step I C-bus byte 23 ‘read data’: 8 SCL + master acknowledge DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 ...
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NXP Semiconductors Table 26. Initialization by instruction, 8-bit interface Step Instruction RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 initialization ends [ not relevant. Table ...
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NXP Semiconductors 17. Package outline LQFP100: plastic low profile quad flat package; 100 leads; body 1 pin 1 index 100 DIMENSIONS (mm are the original ...
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NXP Semiconductors 18. Handling information Inputs and outputs are protected against electrostatic discharge in normal handling. However completely safe you must take normal precautions appropriate to handling MOS devices; see JESD625-A and/or IEC61340-5 . 19. Packing information Fig ...
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NXP Semiconductors Fig 41. Tray alignment The orientation of the pocket is indicated by the position of the IC type name on the die surface with respect to the chamfer on the upper left corner of the ...
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NXP Semiconductors Key characteristics in both wave and reflow soldering are: • Board specifications, including the board finish, solder masks and vias • Package footprints, including solder thieves and orientation • The moisture sensitivity level of the packages • Package ...
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NXP Semiconductors Table 30. Package thickness (mm) < 1.6 1.6 to 2.5 > 2.5 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, ...
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NXP Semiconductors 21. Revision history Table 31. Revision history Document ID Release date PCF2113_FAM_4 20080304 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have ...
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NXP Semiconductors 22. Legal information 22.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors 24. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...
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NXP Semiconductors 21 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 62 22 Legal information ...