PCF8582C-2P-03 PHILIPS [NXP Semiconductors], PCF8582C-2P-03 Datasheet - Page 21

• Manufacturer Part Number: PCF8582C-2P-03
• Description: 256 x 8-bit CMOS EEPROM with I2C-bus interface
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
8
8.1
8.1.1
8.1.2
8.1.3
8.1.4
8.1.5
9
10
11
12
13
14
15
15.1
15.2
15.2.1
15.2.2
15.3
15.3.1
15.3.2
15.3.3
15.4
16
17
18
19
20
© Koninklijke Philips Electronics N.V. 2004.
Printed in the U.S.A.
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 25 October 2004
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Device addressing . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 10
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10
I
Write cycle limits . . . . . . . . . . . . . . . . . . . . . . . 12
External clock timing . . . . . . . . . . . . . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 20
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2
C-bus characteristics . . . . . . . . . . . . . . . . . . 11
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
I
Bus conditions . . . . . . . . . . . . . . . . . . . . . . . . . 6
Data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Device addressing . . . . . . . . . . . . . . . . . . . . . . 7
Write operations . . . . . . . . . . . . . . . . . . . . . . . . 7
Read operations . . . . . . . . . . . . . . . . . . . . . . . . 9
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Through-hole mount packages . . . . . . . . . . . . 16
Soldering by dipping or by solder wave . . . . . 16
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 16
Surface mount packages . . . . . . . . . . . . . . . . 16
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 16
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 17
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17
Package related soldering information . . . . . . 18
2
C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . . 6
Document order number: 9397 750 14222
256
8-bit CMOS EEPROM with I
PCF8582C-2
2
C-bus interface