MK60N256VLL100 FREESCALE [Freescale Semiconductor, Inc], MK60N256VLL100 Datasheet - Page 21

• Manufacturer Part Number: MK60N256VLL100
• Description: Up to 100 MHz ARM Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

4. 15pF load
5.3 Thermal specifications
5.3.1 Thermal operating requirements
5.3.2 Thermal attributes
1.
6 Peripheral operating requirements and behaviors
All digital I/O switching characteristics assume:
Freescale Semiconductor, Inc.
Single-
layer (1s)
Four-
layer
(2s2p)
Single-
layer (1s)
Four-
layer
(2s2p)
—
—
—
1. output pins
Board
type
Symbol
T
T
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
J
A
• have C
R
R
R
R
R
R
Ψ
Symbol Description
θJA
θJA
θJMA
θJMA
θJB
θJC
JT
Die junction temperature
Ambient temperature
Description
L
=30pF loads,
Thermal resistance, junction to ambient
(natural convection)
Thermal resistance, junction to ambient
(natural convection)
Thermal resistance, junction to ambient
(200 ft./min. air speed)
Thermal resistance, junction to ambient
(200 ft./min. air speed)
Thermal resistance, junction to board
Thermal resistance, junction to case
Thermal characterization parameter,
junction to package top outside center
(natural convection)
K60 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.
Table 9. Thermal operating requirements
Preliminary
TBD
TBD
TBD
TBD
TBD
TBD
TBD
LQFP
100
Peripheral operating requirements and behaviors
TBD
TBD
TBD
TBD
TBD
TBD
TBD
MAPBGA
Min.
–40
–40
81
TBD
TBD
TBD
TBD
TBD
TBD
TBD
LQFP
80
Max.
125
105
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
1
1
1
1
2
3
4
Unit
Notes
°C
°C
21