MCP2021-330E-P MICROCHIP [Microchip Technology], MCP2021-330E-P Datasheet
MCP2021-330E-P
Related parts for MCP2021-330E-P
MCP2021-330E-P Summary of contents
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... LIN Transceiver with Voltage Regulator Features • The MCP2021/2/1P/2P are compliant with LIN Bus Specifications 1.3, 2.0, and 2.1 and are compliant to SAE J2602 • Support Baud Rates Kbaud with LIN-compatible output driver • 43V Load dump protected • Very low EMI meets stringent OEM requirements • ...
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... TXD 4 5 PDIP-14, SOIC-14, TSSOP- RXD CS/LWAKE REG TXD RESET MCP2021/2 Block Diagram Short Circuit Protection Internal Circuits V REG RXD CS/LWAKE TXD FAULT/TXE DS22018F-page 2 FAULT/TXE BUS V SS FAULT/TXE BUS ...
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... MCP2021P/2P Block Diagram Short-Circuit Protection Internal Circuits V REG RXD CS/LWAKE TXD FAULT/TXE © 2005-2012 Microchip Technology Inc. MCP2021/2/1P/2P Thermal Protection Voltage Regulator Ratiometric Reference Wake-Up Logic and Power Control – Short-Circuit Thermal and Protection Short-Circuit Protection RESET (MCP2022P ) ONLY V BB ~30 kΩ ...
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... MCP2021/2/1P/2P NOTES: DS22018F-page 4 © 2005-2012 Microchip Technology Inc. ...
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... Section 1.6 “Internal Regulator”). MCP2021/2 wakes from Power-Down mode on a dominant level on LBUS. MCP2021P/2P wakes at a transition from recessive level to dominant level on LBUS. 1.1 Optional External Protection 1.1.1 REVERSE BATTERY PROTECTION An external reverse-battery-blocking diode should be used to provide polarity protection (see 1 ...
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... If a microcontroller is being driven by the voltage regulator output, it will go through a POR and initialization sequence. The LIN pin is in the reces- sive state for MCP2021/2 and in floating state for MCP2021P/2P. The device will stay in Ready mode until the output of the voltage regulator has stabilized and the CS/LWAKE pin is true (‘ ...
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... BUS imately 0.4V for at least a typical duration of 20 µs. BB The MCP2021/2 device is level sensitive to L inant level longer than 20 µs will cause the device to leave the Power-Down mode. The MCP2021P/2P device is falling-edge sensitive to L BUS transition from recessive to dominant followed by at least 20 µ ...
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... ESD diodes and may damage the device. CS/LWAKE=0 FAULT/TXE=0 Or Faults* Transmitter Off TX: OFF RX: ON VREG: ON *Fault: thermal shutdown and TXD/LBUS permanent dominant FIGURE 1-3: MCP2021P/2P Operational Modes State Diagrams. DS22018F-page 8 Power-Down TX: OFF RX: OFF VREG: OFF CS/LWAKE=0 Operation CS/LWAKE=1 TX dominant level on LBUS ...
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... CS_LWAKE 0 VREG nFAULT_TXE 0 LBUS State FIGURE 1-4: MCP2021P/2P Wake-Up Due to Bus Disconnecting. © 2005-2012 Microchip Technology Inc. MCP2021/2/1P/2P Sleep Ready DS22018F-page 9 ...
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... FAULT/TXE L BUS STATE Operation Mode Forced Power-Down Mode after BUS-OFF instruction or a longer LIN-Bus inactivity ( > sec according to LIN specification) FIGURE 1-5: Forced Power-Down Mode Sequence for MCP2021P/2P. DS22018F-page 10 t > CSactive FAULT/TXE = 0 Forced externally LBUS disconnected; e.g., Master pull-up & internal resistor off; ...
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... Read VBB; if VBB>5.75V, enter Ready mode ON MCP2021/2: If CS/LWAKE is high level, then Operation mode. MCP2021P/2P: If CS/LWAKE is high level and FAULT/TXE is high level, then Operation mode. If CS/LWAKE is high level and FAULT/TXE is low level, then TXOFF mode CS/LWAKE is low level, then Power- Down mode ...
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... MCP2021/2/1P/2P 1.4 Pin Descriptions TABLE 1-1: PINOUT DESCRIPTIONS Devices 8-Pin 14-Pin Pin DFN, PDIP, Name PDIP, SOIC, SOIC TSSOP REG TXD 4 4 RXD BUS CS/LWAKE 2 2 FAULT/TXE 8 14 RESET — 5 Legend Output Power Input, TTL = TTL input buffer Open-Drain output 1 ...
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... Alternately, it can act as an external brown-out by con- necting the RESET output to MCLR (see addition to monitoring the internal voltage, RESET is asserted immediately upon entering the Power-Down mode. © 2005-2012 Microchip Technology Inc. MCP2021/2/1P/2P This pin has approximately 750 kΩ. Note 1: The FAULT/TXE pin is true (0) whenever ...
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... F 3: This diode is only needed if CS/LWAKE is connected to a 12V supply. 4: Transient suppressor diode. Vclamp L = 43V. 5: These components are required for additional load dump protection above 43V. FIGURE 1-6: Typical MCP2021/MCP2021P Application. DS22018F-page 14 + (5) ...
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... These components are required for additional load dump protection above 43V. 6: Required if CPU does not have internal pull-up. FIGURE 1-7: Typical MCP2022/MCP2022P Application. 1 kΩ LIN bus MCP202X Master µC FIGURE 1-8: Typical LIN Network Configuration. © 2005-2012 Microchip Technology Inc. MCP2021/2/1P/2P + (5) 43V REG TXD RXD ...
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... V will track the input down to approximately 3.5V, at which point the regulator will turn off. This will allow microcontrollers with internal POR circuits to generate a clean arming of the POR trip point. The MCP2021 will then monitor V and turn on the regulator when V BB rises above 5 ...
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... V REG V 5.0 3 Note 1: Start-up FIGURE 1-10: Voltage Regulator Output on POR. © 2005-2012 Microchip Technology Inc. MCP2021/2/1P/2P ±3% DC +125°C. All REG will turn off. (1) (2) (3) < 5.75V, regulator off. BB > 5.75V, regulator on. BB ≤ 5.5V, regulator tracks < 4.25V, regulator will turn off. ...
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... MCP2021/2/1P/ 3 REG 3 Note 1: Voltage regulator on FIGURE 1-11: Voltage Regulator Output on Power Dip. DS22018F-page 18 (1) (2) (3) (4) ≤ 5.5V, regulator tracks V until < 3.5V, regulator is off. REG > 5.75V, regulator on < 4.25V. © 2005-2012 Microchip Technology Inc. ...
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... REG FIGURE 1-12: Voltage Regulator Output on Overcurrent Situation. 1.7 ICSP™ Considerations The following should be considered when the MCP2021/2/1P/2P is connected to pins supporting in-circuit programming: • Power used for programming the microcontroller can be supplied from the programmer or from the MCP2021/2/1P/2P. • The voltage on V should not exceed the ...
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... MCP2021/2/1P/2P NOTES: DS22018F-page 20 © 2005-2012 Microchip Technology Inc. ...
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... Exposure to maximum rating conditions for extended periods may affect device reliability. © 2005-2012 Microchip Technology Inc. MCP2021/2/1P/2P REG DS22018F-page 21 +0.3V ...
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... MCP2021/2/1P/2P 2.2 DC Specifications Electrical Characteristics: Unless otherwise indicated, all limits are specified for: DC Specifications V = 6.0V to 18. -40°C to +125° LOADREG Parameter Sym Power V Quiescent Operating I BB BBQ Current V Transmitter-off I BB BBTO Current V Power-Down Current I BB BBPD V Current with BBNOGND ...
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... Internal current limited. 2.0 ms maximum recovery time (R 2: For design guidance only, not tested. 3: Node has to sustain the current that can flow under this condition; bus must be operational under this condition. © 2005-2012 Microchip Technology Inc. MCP2021/2/1P/ µF Min. Typ. Max. ) 0.6 V — ...
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... Internal current limited. 2.0 ms maximum recovery time (R 2: For design guidance only, not tested. 3: Node has to sustain the current that can flow under this condition; bus must be operational under this condition FIGURE 2-1: MCP2021-500 Safe Operating Range. DS22018F-page µF Min. Typ. Max. 4.85 5.00 5.15 2 — — ...
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... For design guidance only, not tested. 3: Node has to sustain the current that can flow under this condition; bus must be operational under this condition FIGURE 2-2: MCP2021-330 Safe Operating Range. © 2005-2012 Microchip Technology Inc. MCP2021/2/1P/ µF Min. Typ. Max. 3.20 3.30 3.40 1 — ...
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... MCP2021/2/1P/ Instable 0.1 0.01 0.001 0.1 FIGURE 2-3: ESR Curves for Load Capacitor Selection. DS22018F-page 26 ESR Curves Instable Stable only with Tantalum or Electrolytic cap. Stable Tantalum, Electrolytic and Ceramic cap. Instable 1 10 Load Capacitor [uF] with 1000 100 © 2005-2012 Microchip Technology Inc. ...
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... Delay of Transmitter rising edge w.r.t. falling edge Time to sample of FAULT/ t FAULT TXE for bus conflict reporting Duty Cycle 1 @20.0 kbit/sec Duty Cycle 2 @20.0 kbit/sec Duty Cycle 3 @10.4 kbit/sec Duty Cycle 4 @10.4 kbit/sec © 2005-2012 Microchip Technology Inc. MCP2021/2/1P/2P = -40°C to +125°C A Min. Typ. Max. Units 3.5 — 22.5 µs — ...
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... Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP Note 1: The maximum power dissipation is a function of T allowable power dissipation at an ambient temperature is P exceeded, the die temperature will rise above 150°C and the MCP2021 will go into thermal shutdown. DS22018F-page 28 = -40°C to +125°C A Min. ...
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... RXD Internal TXD/RXD Match Match Compare FAULT Sampling Hold FAULT/TXE Output Stable Value FIGURE 2-4: Bus Timing Diagram. CS/LWAKE V OUT FIGURE 2-5: Regulator CS/LWAKE Timing Diagram. © 2005-2012 Microchip Technology Inc. MCP2021/2/1P/2P 50% T TRANSPDF T RECPDF 50% Match Match T FAULT Hold Stable Value T CSOR T .95V LBUS ...
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... MCP2021/2/1P/2P L BUS V REG V OUT FIGURE 2-6: Regulator BUS WAKE Timing Diagram REG RESET T RPU FIGURE 2-7: RESET Timing Diagram. DS22018F-page 30 T VEVR 0. BDB BACTVE T RPD © 2005-2012 Microchip Technology Inc. 6.0V 5.0V 5.0V 4.0V 3.5V T RPD ...
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... CS/LWAKE V OUT T RPU RESET FIGURE 2-8: CS/LWAKE to RESET Timing Diagram. 0.2 0.15 0.1 0.05 0 -40C FIGURE 2-9: Typical I vs. Temperature. BBQ © 2005-2012 Microchip Technology Inc. MCP2021/2/1P/2P T CSOR T CSPD 25C 85C Temperature (°C) V REG Vbb = 6V Vbb = 7.3V Vbb = 12V Vbb = 14.4V Vbb = 18V 125C DS22018F-page 31 ...
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... MCP2021/2/1P/2P 0.18 0.16 0.14 0.12 0.1 0.08 0.06 0.04 0.02 0 -40C FIGURE 2-10: Typical I vs Temperature. BBTO 0.025 0.02 0.015 0.01 0.005 0 -40C FIGURE 2-11: Typical I vs. Temperature. BBPD DS22018F-page 32 25C 85C Temperature (°C) Vbb = 6V Vbb = 7.3V Vbb = 12V Vbb = 14.4V Vbb = 18V 25C 85C 125C Temperature (°C) © 2005-2012 Microchip Technology Inc. Vbb = 6V Vbb = 7.3V Vbb = 12V Vbb = 14 ...
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... Microchip Technology Inc. MCP2021/2/1P/2P Example 202150 E/MD MCP2021 MCP2021P 1033 2021500 2021P50 MCP2021 202150 E/P 256 MCP2021 MCP2021P 2021500 2021P500 3 256 PIN 1 Example 2021500 E/MF 3 1033 256 PIN 1 Example ...
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... Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. DS22018F-page 34 MCP2021 MCP2021P 2021500E 2021P50E MCP2022 MCP2022P MCP2022-500 MCP2022P-500 MCP2022 ...
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... Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2005-2012 Microchip Technology Inc. MCP2021/2/1P/2P MCP2022 MCP2022P 2022500E 2022P50E Example ...
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... MCP2021/2/1P/2P 8-Lead Plastic Dual Flat, No Lead Package (MD) – 4x4x0.9 mm Body [DFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging NOTE 1 TOP VIEW A3 Number of Pins Pitch Overall Height Standoff Contact Thickness Overall Length ...
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... MCP2021/2/1P/2P 8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N NOTE TOP VIEW A3 Number of Pins Pitch Overall Height Standoff Contact Thickness Overall Length ...
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... WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZPLFURFKLSFRPSDFNDJLQJ © 2005-2012 Microchip Technology Inc. MCP2021/2/1P/2P DS22018F-page 39 ...
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... MCP2021/2/1P/2P 8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane ...
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... Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. © 2005-2012 Microchip Technology Inc. MCP2021/2/1P/ ...
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... MCP2021/2/1P/2P )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZPLFURFKLSFRPSDFNDJLQJ DS22018F-page 42 © 2005-2012 Microchip Technology Inc. ...
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... Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. © 2005-2012 Microchip Technology Inc. MCP2021/2/1P/ ...
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... MCP2021/2/1P/2P 14-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width ...
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... WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZPLFURFKLSFRPSDFNDJLQJ © 2005-2012 Microchip Technology Inc. MCP2021/2/1P/2P DS22018F-page 45 ...
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... MCP2021/2/1P/2P 14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N NOTE Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width ...
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... APPENDIX A: REVISION HISTORY Revision F (January 2012) The following modifications were made to this data sheet: Added the MCP2021P and MCP2022P options and related information throughout document. Revision E (February 2009) The following is the list of modifications. 1. Added Example 1-7 and Example 1-8. 2. Updated Section 1.4.9 “RESET”. ...
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... MCP2021/2/1P/2P NOTES: DS22018F-page 48 © 2005-2012 Microchip Technology Inc. ...
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... MCP2022T: LIN Transceiver with Voltage Regulator, and RESET pin; wakes up on dominant level of LIN bus. (Tape and Reel) (SOIC only) MCP2021P: LIN Transceiver with Voltage Regulator; wakes falling edge of LIN bus level. MCP2021PT: LIN Transceiver with Voltage Regulator; wakes ...
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... MCP2021/2/1P/2P NOTES: DS22018F-page 50 © 2005-2012 Microchip Technology Inc. ...
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Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families ...
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