ENC28J60-C/ML MICROCHIP [Microchip Technology], ENC28J60-C/ML Datasheet - Page 89

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ENC28J60-C/ML

Manufacturer Part Number
ENC28J60-C/ML
Description
Stand-Alone Ethernet Controller with SPI Interface
Manufacturer
MICROCHIP [Microchip Technology]
Datasheet
28-Lead Plastic Quad Flat No Lead Package (ML) 6x6 mm Body (QFN) –
With 0.55 mm Contact Length (Saw Singulated)
© 2006 Microchip Technology Inc.
* Controlling Parameter
§ Significant Characteristic
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Exposed pad varies according to die attach paddle size.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC equivalent: MO-220
Drawing No. C04-105
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length §
Contact-to-Exposed Pad
A1
See ASME Y14.5M
See ASME Y14.5M
TOP VIEW
Dimension Limits
E
§
Units
E2
D2
A3
A1
E
D
K
n
e
A
L
OPTIONAL
INDEX
AREA
(NOTE 1)
MIN
.000
.232
.153
.232
.153
.009
.018
.008
.031
Preliminary
D
EXPOSED
(NOTE 2)
.026 BSC
.008 REF
INDICATORS
METAL
ALTERNATE
INCHES
A
NOM
PAD
PAD OUTLINE
D2
.035
.001
.236
.167
.236
.167
.011
.022
ALTERNATE
INDEX
28
DETAIL
2
1
MAX
n
.039
.002
.240
.169
.240
.169
.013
.024
BOTTOM VIEW
SEE DETAIL
MIN
E2
0.80
0.00
5.90
3.89
5.90
3.89
0.23
0.45
0.20
MILLIMETERS*
0.65 BSC
0.20 REF
ENC28J60
NOM
Revised 09-12-05
0.90
0.02
6.00
4.24
6.00
4.24
0.28
0.55
28
L
DS39662B-page 87
MAX
b
K
e
1.00
0.05
6.10
4.29
6.10
4.29
0.33
0.65

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