XTR111_07 BURR-BROWN [Burr-Brown Corporation], XTR111_07 Datasheet - Page 2

• Manufacturer Part Number: XTR111_07
• Description: Precision Voltage-to-Current Converter/Transmitter
• Manufacturer: BURR-BROWN [Burr-Brown Corporation]

XTR111
SBOS375 − NOVEMBER 2006
PIN CONFIGURATIONS
2
ABSOLUTE MAXIMUM RATINGS
Power Supply Voltage, V
Output Short-Circuit Duration
(2) Refer to the Package Option Addendum at the end of this
(3) Input terminals are diode-clamped to the power-supply rails.
(4) The IS pin can source up to the output current-limit under normal
(5) See text in Application Section regarding safe voltage ranges
Voltage at SET
Voltage at IS
Voltage at REGS, REGF, VIN, OD, EF
Voltage at REGF, VG
Current into any pin
Operating Temperature Range
Storage Temperature Range
Electrostatic Discharge Rating (HBM)
(1) Stresses above these ratings may cause permanent damage.
TOP VIEW
VG
REGF
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
document for lead temperature ratings.
Input signals that can swing more than 0.5V beyond the supply
rails must be current limited.
operating conditions.
and currents.
. . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . .
(3, 5)
(3)
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . .
(3, 4)
. . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
VSP
(5)
. . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . .
:
. . . . . . . . . . . . . . .
Continuous to common and V
Continuous to common and V
(V
VSP
. . . . . . . . . . . . . . . . .
. .
) − 5.5V to (V
−0.5V to (V
−0.5V to (V
REGS
REGF
Pad
VSP
VG
(1)(2)
IS
−55°C to +125°C
−65°C to +150°C
−0.5V to +14V
1
2
3
4
5
VSP
VSP
VSP
) + 0.5V
) + 0.5V
) + 0.5V
±25mA
2000V
+44V
VSP
VSP
Underside.
connected
Exposed
(Must be
Thermal
to GND)
DFN−10
Die Pad
on
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PIN DESCRIPTIONS
PACKAGE/ORDERING INFORMATION
PRODUCT
(1) For the most current package and ordering information, see the
PIN
1
2
3
4
5
6
7
8
9
10
Pad
XTR111
Package Option Addendum at the end of this document, or see
the TI web site at www.ti.com.
10
NAME
REGS
REGF
9
8
7
6
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
GND
VSP
SET
Pad
VIN
VG
OD
EF
PACKAGE-LEAD
IS
GND
OD
EF
SET
VIN
DFN-10
FUNCTION
Positive Supply
Source Connection
Gate Drive
Regulator Sense
Regulator Force
Input Voltage
Transconductance Set
Error Flag (Active Low)
Output Disable (Active High)
Negative Supply
Exposed Thermal Pad must be connected
to GND
DESIGNATOR
PACKAGE
DRC
www.ti.com
PACKAGE
MARKING
(1)
BSV
DFN