ADG659YCP-REEL7 AD [Analog Devices], ADG659YCP-REEL7 Datasheet - Page 20

• Manufacturer Part Number: ADG659YCP-REEL7
• Manufacturer: AD [Analog Devices]

ADG658/ADG659
ORDERING GUIDE
Model
ADG658YRU
ADG658YRU-REEL7
ADG658YCP
ADG658YCP-REEL7
ADG658YRQ
ADG658YRQ-REEL
ADG658YRQ-REEL7
ADG659YRU
ADG659YRU-REEL7
ADG659YCP
ADG659YCP-REEL7
ADG659YCPZ
ADG659YCPZ-REEL7
ADG659YRQ
ADG659YRQ-REEL
ADG659YRQ-REEL7
1
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = Pb-free part.
1
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +85°C
−40°C to +85°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
COPLANARITY
0.010
0.004
0.065
0.049
C03273-0-7/04(A)
0.004
Figure 34. 16-Lead Shrink Small Outline Package [QSOP]
16
1
PIN 1
0.025
BSC
COMPLIANT TO JEDEC STANDARDS MO-137AB
0.193
BSC
Dimensions shown in millimeters
0.012
0.008
Rev. A | Page 20 of 20
9
8
SEATING
PLANE
Package Description
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Shrink Small Outline Package (QSOP)
Shrink Small Outline Package (QSOP)
Shrink Small Outline Package (QSOP)
Thin Shrink Small Outline Package (TSSOP)
Thin Shrink Small Outline Package (TSSOP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Lead Frame Chip Scale Package (LFCSP)
Shrink Small Outline Package (QSOP)
Shrink Small Outline Package (QSOP)
Shrink Small Outline Package (QSOP)
(RQ-16)
0.154
0.069
0.053
BSC
0.236
BSC
0.010
0.006
8°
0°
0.050
0.016
Package Option
RU-16
RU-16
RQ-16
RQ-16
RQ-16
RU-16
RU-16
CP-16
CP-16
RQ-16
RQ-16
RQ-16
CP-16
CP-16
CP-16
CP-16