ADA4938-1YCPZ-R2 AD [Analog Devices], ADA4938-1YCPZ-R2 Datasheet - Page 7

• Manufacturer Part Number: ADA4938-1YCPZ-R2
• Description: Ultra-Low Distortion Differential ADC Driver
• Manufacturer: AD [Analog Devices]

Preliminary Technical Data
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Power Dissipation
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
Junction Temperature
Stresses above those listed under Absolute Maximum
Rating may cause permanent damage to the device. This is
a stress rating only; functional operation of the device at
these or any other conditions above those indicated in the
operational section of this specification is not implied.
Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
THERMAL RESISTANCE
θ
specified for a device (including exposed pad) soldered to
the circuit board.
Table 4. Thermal Resistance
Package Type
16-Lead LFCSP (Exposed Pad)
Maximum Power Dissipation
The maximum safe power dissipation in the ADA4938-1
package is limited by the associated rise in junction
temperature (T
is the glass transition temperature, the plastic changes its
properties. Even temporarily exceeding this temperature
limit can change the stresses that the package exerts on the
die, permanently shifting the parametric performance of
the ADA4938-1. Exceeding a junction temperature of 150°C
for an extended period can result in changes in the silicon
devices, potentially causing failure.
JA
is specified for the worst-case conditions; that is, θ
J
) on the die. At approximately 150°C, which
θ
TBD
JA
Rating
TBD
See Figure 2
−65°C to +125°C
−40°C to +85°C
300°C
150°C
Unit
°C/W
JA
is
Rev. PrA | Page 7 of 9
The power dissipated in the package (P
quiescent power dissipation and the power dissipated in the
package due to the load drive. The quiescent power is the
voltage between the supply pins (V
current (I
upon the particular application. The power due to load drive is
calculated by multiplying the load current by the associated
voltage drop across the device. RMS voltages and currents must
be used in these calculations.
Airflow increases heat dissipation, effectively reducing θ
addition, more metal directly in contact with the package
leads/exposed pad from metal traces, through-holes, ground,
and power planes reduces the θ
Figure 2 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 16-lead LFCSP
(TBD °C/W) on a JEDEC standard 4-layer board.
ESD CAUTION
Figure 2. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
S
). The power dissipated due to the load drive depends
JA
.
S
) times the quiescent
D
) is the sum of the
ADA4938-1
JA
. In