INA101SG BURR-BROWN [Burr-Brown Corporation], INA101SG Datasheet - Page 3

• Manufacturer Part Number: INA101SG
• Description: High Accuracy INSTRUMENTATION AMPLIFIER
• Manufacturer: BURR-BROWN [Burr-Brown Corporation]

ORDERING INFORMATION
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix D of Burr-Brown IC Data Book.
PIN CONFIGURATIONS
PACKAGE INFORMATION
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
Adjust
Adjust
Offset
Offset
PRODUCT
INA101AM
INA101CM
INA101AG
INA101CG
INA101HP
INA101KU
INA101SG
INA101SM
PRODUCT
INA101AM
INA101CM
INA101AG
INA101CG
INA101HP
INA101KU
INA101SG
INA101SM
Gain Set
Top View
Gain
Set
2
3
4
1
M Package
TO-100
SOL-16 Surface-Mount
SOL-16 Surface-Mount
10-Pin Metal TO-100
10-Pin Metal TO-100
10-Pin Metal TO-100
10-Pin Metal TO-100
10-Pin Metal TO-100
10-Pin Metal TO-100
–In
14-Pin Ceramic DIP
14-Pin Ceramic DIP
14-Pin Ceramic DIP
14-Pin Ceramic DIP
14-Pin Ceramic DIP
14-Pin Ceramic DIP
+In
10
5
14-Pin Plastic DIP
14-Pin Plastic DIP
PACKAGE
PACKAGE
9
6
+V
–V
8
7
CC
CC
Output
Common
Gain Sense 1
Gain Set 1
Offset Adj.
Offset Adj.
TEMPERATURE RANGE
Output
–Input
PACKAGE DRAWING
+V
NC
–55 C to +125 C
–55 C to +125 C
CC
–25 C to +85 C
–25 C to +85 C
–25 C to +85 C
–25 C to +85 C
0 C to +70 C
0 C to +70 C
NUMBER
1
2
3
4
5
6
7
8
007
007
169
169
010
211
169
007
(1)
U Package
SOIC
3
ABSOLUTE MAXIMUM RATINGS
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with ap-
propriate precautions. Failure to observe proper handling and
installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
16
15
14
13
12
11
10
9
Supply Voltage ................................................................................... 20V
Power Dissipation .......................................................................... 600mW
Input Voltage Range .......................................................................... V
Output Short Circuit (to ground) ............................................... Continuous
Operating Temperature M, G Package ........................... –55 C to +125 C
Storage Temperature M, G Package .............................. –65 C to +150 C
Lead Temperature (soldering, 10s) M, G, P Package ................... +300 C
Lead Temperature (wave soldering, 3s) U Package ...................... +260 C
P, U Package ................................................................. –25 C to +85 C
P, U Package ................................................................. –40 C to +85 C
Common
–V
+Input
Gain Sense 2
Gain Set 2
A2 Output
A1 Output
NC
CC
ELECTROSTATIC
DISCHARGE SENSITIVITY
Gain Sense 1
Gain Set 1
Offset Adj.
Offset Adj.
Output
–Input
+V
CC
1
2
3
4
5
6
7
G and P Package
INA101
DIP
14
13
12
11
10
9
8
Common
–V
+Input
Gain Sense 2
Gain Set 2
A2 Output
A1 Output
CC
CC
®