MCP1702-2502E/CB MICROCHIP [Microchip Technology], MCP1702-2502E/CB Datasheet - Page 4

• Manufacturer Part Number: MCP1702-2502E/CB
• Description: 250 mA Low Quiescent Current LDO Regulator
• Manufacturer: MICROCHIP [Microchip Technology]

MCP1702
DC CHARACTERISTICS (CONTINUED)
TEMPERATURE SPECIFICATIONS (NOTE 1)
DS22008B-page 4
Electrical Specifications: Unless otherwise specified, all limits are established for V
I
Boldface type applies for junction temperatures, T
Dropout Voltage
(Note 1, Note 5)
Output Delay Time
Output Noise
Power Supply Ripple
Rejection Ratio
Thermal Shutdown Protection
Note 1:
Temperature Ranges
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistance
Thermal Resistance, 3L-SOT-23A
Thermal Resistance, 3L-SOT-89
Thermal Resistance, 3L-TO-92
LOAD
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
= 100 µA, C
2:
3:
4:
5:
6:
7:
Parameters
The minimum V
V
The input voltage V
TCV
temperature range. V
Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output
voltage due to heating effects are determined using thermal regulation specification TCV
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured
value with an applied input voltage of V
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., T
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 150°C can impact the device reliability.
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
ambient temperature is not significant.
temperature and the thermal resistance from junction to air (i.e., T
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 150°C can impact the device reliability.
R
Parameters
is the nominal regulator output voltage. For example: V
OUT
OUT
= (V
= 1 µF (X7R), C
OUT-HIGH
IN
must meet two conditions: V
IN
V
OUT-LOW
= V
DROPOUT
T
- V
PSRR
Sym
DELAY
T
e
OUT(MAX)
OUT-LOW
SD
N
IN
= 1 µF (X7R), T
= lowest voltage measured over the temperature range.
Sym
) *10
θ
θ
θ
θ
θ
θ
T
+ V
T
T
JA
JC
JA
JC
JA
JC
A
J
J
Min
J
DROPOUT(MAX)
—
—
—
—
—
—
—
—
—
6
OUT(MAX)
of -40°C to +125°C. (Note 7)
/ (V
R
A
Min
-40
-40
-65
—
—
—
—
—
—
* ΔTemperature), V
= +25°C.
IN
1000
Typ
330
525
625
750
150
+ V
≥ 2.7V and V
44
—
8
DROPOUT(MAX)
or V
131.9
66.3
Typ
336
110
52
10
IN
R
1100
Max
650
725
975
= 2.7V (whichever is greater); I
—
—
—
—
= 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V.
IN
+125
+125
+150
Max
≥ V
OUT-HIGH
A
—
—
—
—
—
—
A
, T
or 2.7V, whichever is greater.
, T
OUT(MAX)
µV/(Hz)
J
J
, θ
Units
, θ
mV
mV
mV
mV
mV
dB
°C
µs
JA
IN
Units
JA
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
= highest voltage measured over the
). Exceeding the maximum allowable power
°C
°C
°C
= V
). Exceeding the maximum allowable power
1/2
+ V
OUT(MAX)
I
I
I
I
V
Current Parameter
V
R
I
f = 100 Hz, C
V
V
DROPOUT(MAX)
EIA/JEDEC JESD51-7
FR-4 0.063 4-Layer Board
EIA/JEDEC JESD51-7
FR-4 0.063 4-Layer Board
L
L
L
L
L
R
IN
INAC
R
L
= 250 mA, V
= 250 mA, 3.3V ≤ V
= 250 mA, 2.8V ≤ V
= 250 mA, 2.5V ≤ V
= 50 mA, f = 1 kHz, C
= 50Ω resistive
= 1.2V
< 2.5V, See Maximum Output
= 0V to 6V, V
© 2007 Microchip Technology Inc.
= 100 mV pk-pk, C
+ V
OUT
OUT
DROPOUT(MAX)
.
Conditions
Conditions
OUT
= 100 µA.
.
R
= 5.0V
OUT
= 1 µF, I
= 90% V
R
R
R
< 5.0V
< 3.3V
< 2.8V
OUT
, Note 1,
IN
L
= 50 mA,
= 0 µF,
= 1 µF
R