TC72-2.8MMF MICROCHIP [Microchip Technology], TC72-2.8MMF Datasheet - Page 17

• Manufacturer Part Number: TC72-2.8MMF
• Manufacturer: MICROCHIP [Microchip Technology]

8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN)
2002 Microchip Technology Inc.
A3
Number of Pins
Pitch
Overall Height
Standoff
Lead Thickness
Overall Length
Exposed Pad Length
Overall Width
Exposed Pad Width
Lead Width
Lead Length
*Controlling Parameter
Notes:
1.
2.
3.
4.
5. JEDEC equivalent: Pending
Drawing No. C04-062
Package may have one or more exposed tie bars at ends.
Pin 1 visual index feature may vary, but must be located within the hatched area.
Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
Exposed pad dimensions vary with paddle size.
TOP VIEW
E
Dimension Limits
Units
A1
A3
E2
D2
A
E
D
n
p
b
L
A1
D
MIN
A
.031
.000
.055
.047
.007
.012
EXPOSED
.008 REF.
INCHES
.026 BSC
.118 BSC
.118 BSC
NOM
METAL
EXPOSED
(NOTE 1)
PAD
.035
.001
.010
.019
TIE BAR
8
MAX
.039
.002
.096
.069
.015
.022
b
BOTTOM VIEW
MIN
E2
0.80
0.00
1.39
1.20
0.23
0.30
2
p
MILLIMETERS*
1
0.20 REF.
n
0.65 BSC
3.00 BSC
3.00 BSC
NOM
0.90
0.02
0.26
0.48
(NOTE 2)
PIN 1
ID INDEX
AREA
8
D2
DS21743A-page 17
L
MAX
TC72
1.00
0.05
2.45
1.75
0.37
0.55