UPG2121TB-E3 NEC, UPG2121TB-E3 Datasheet - Page 7

• Manufacturer Part Number: UPG2121TB-E3
• Description: L-BAND UP/DOWN CONVERTER
• Manufacturer: NEC

RECOMMENDED SOLDERING CONDITIONS
conditions other than those recommended below, contact your NEC sales representative.
Infrared Reflow
VPS
Wave Soldering
Partial Heating
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Soldering Method
Caution Do not use different soldering methods together (except for partial heating).
This product should be soldered under the following recommended conditions.
Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.
For details of recommended soldering conditions for surface mounting, refer to information document
Package peak temperature: 235 °C or below
Time: 30 seconds or less (at 210 °C)
Count: 3, Exposure limit: None
Package peak temperature: 215 °C or below
Time: 40 seconds or less (at 200 °C)
Count: 3, Exposure limit: None
Soldering bath temperature: 260 °C or below
Time: 10 seconds or less
Count: 1, Exposure limit: None
Pin temperature: 300 °C
Time: 3 seconds or less (per side of device)
Exposure limit: None
Note
Preliminary Data Sheet P15014EJ1V0DS00
Soldering Conditions
Note
Note
Note
Recommended Condition Symbol
For soldering methods and
WS60-00-1
VP15-00-3
IR35-00-3
–
PG2121TB
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