SLE66C168PEC Infineon Technologies AG, SLE66C168PEC Datasheet - Page 3

• Manufacturer Part Number: SLE66C168PEC
• Description: Security & Chip Card ICs
• Manufacturer: Infineon Technologies AG

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16-Bit Security Controller with enhanced instruction set for large
memories in 0.22µm CMOS Technology, 68-Kbyte ROM, 2304 Bytes
RAM, 16-Kbyte EEPROM, Dual Key Triple DES Accelerator
Features
Preliminary - Short Product Information
8/16-bit microcomputer in 0.22 µm CMOS technology
Instruction set opcode compatible with standard
SAB 8051 processor
Downward compatibility to existing SLE 66CxxxP
products for existing masks without using the
new features
Addressable memory up to 16 Mbyte
Additional enhanced instructions for direct
physical memory access of >64kByte
Dedicated, non-standard architecture with execution
time 6 times faster than standard SAB 8051
processor at same external clock. (Up to 18 times
faster using internal frequency PLL x 3 compared to
external clock).
68 Kbytes User ROM for application programs
16 Kbytes MicroSlim-EEPROM
2 Kbytes XRAM, 256 bytes internal RAM
Enhanced Memory Management and Protection
Unit (MMU) with application and user defined
segments
Dual Key Triple DES (DDES)
True Random Number Generator with Firmware test
function
CRC Module
16-bit Interrupt Module
EEPROM programming voltage generated on chip
CC EAL5+ certification according to BSI-PP-0002
planned
Code executions during E²-programming for faster
personalization
Typically saves up to 90 % code space and
increases execution speed up to 80 %.
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MicroSlim-EEPROM
Internal Clock with up to 33 MHz:
Programmable internal frequency (PLL x1, x2, x3, x4
and free running mode(s)).
Adjustable frequency according to available power
or required performance
Two 16-bit Autoreload Timer
Power saving sleep mode
Ext. Clock freq. 1 up to 7.5 MHz for int. Clock up to
33 MHz
UART for handling serial interface in accordance
with ISO/IEC 7816 part 3 supporting transmission
protocols T=1 and T=0
Supply voltage range:1.8 V, 3.0 V, 5.0 V
Operating Temperature range: -25 to +85°C
Storing temperature range: –40° to +125°C
ESD protection larger than 6 kV (HBM)
Typical Erase + Write time
Enhanced ECC module controlled by OS
Reading and programming byte by byte
Platform prepared for flash-like erasing of E²-segments
up to 2 kB
Flexible page mode for 1 to 64 bytes write/erase
operation
32 bytes security area (OTP)
Fast personalization mode
Minimum of 500.000 write/erase cycles @ 25°C per
page. Maximum of 16.500.000 write/erase cycles per
sector
Typical data retention of 10 years @ 25°C
< 10 mA @ 5.5 V
< 6 mA @ 3.3 V
< 4 mA @ 1.98 V
Support of current consumption limits by GSM / UICC
applications
Increased internal clock frequency for maximum
performance
Internal frequency is automatically adjusted to
guarantee a given limited power
consumption
SLE 66C168PE
2.9 ms
1.0 ms
02.04