K4H560838F-UCC4 Samsung semiconductor, K4H560838F-UCC4 Datasheet - Page 17

• Manufacturer Part Number: K4H560838F-UCC4
• Description: 256Mb F-die DDR400 SDRAM Specification
• Manufacturer: Samsung semiconductor

Table 4 : Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate
Table 5 : Output Slew Rate Characteristice (X8 Devices only)
Table 6 : Output Slew Rate Characteristice (X16 Devices only)
Table 7 : Output Slew Rate Matching Ratio Characteristics
System Characteristics for DDR SDRAM
The following specification parameters are required in systems using DDR400 devices to ensure proper system perfor-
mance. these characteristics are for system simulation purposes and are guaranteed by design.
Table 1 : Input Slew Rate for DQ, DQS, and DM
Table 2 : Input Setup & Hold Time Derating for Slew Rate
Table 3 : Input/Output Setup & Hold Time Derating for Slew Rate
PARAMETER
Output Slew Rate Matching Ratio (Pullup to Pulldown)
DDR SDRAM 256Mb F-die (x8, x16)
PARAMETER
DQ/DM/DQS input slew rate measured between
VIH(DC), VIL(DC) and VIL(DC), VIH(DC)
Slew Rate Characteristic
Slew Rate Characteristic
Delta Slew Rate
Input Slew Rate
Input Slew Rate
+/- 0.25 V/ns
+/- 0.0 V/ns
+/- 0.5 V/ns
Pullup Slew Rate
Pullup Slew Rate
0.5 V/ns
0.4 V/ns
0.3 V/ns
0.5 V/ns
0.4 V/ns
0.3 V/ns
Pulldown slew
Pulldown slew
AC CHARACTERISTICS
AC CHARACTERISTICS
+100
+100
+150
tDS
+50
+50
tDS
+75
tIS
0
0
0
Typical Range
Typical Range
1.2 ~ 2.5
1.2 ~ 2.5
1.2 ~ 2.5
1.2 ~ 2.5
(V/ns)
(V/ns)
+100
+150
tDH
+50
tDH
+75
tIH
0
0
0
0
0
Minimum
Minimum
(V/ns)
(V/ns)
1.0
1.0
0.7
0.7
DCSLEW
SYMBOL
MIN
-
DDR400
Units
Units
Units
ps
ps
ps
ps
ps
ps
ps
ps
ps
Maximum
Maximum
MAX
MIN
(V/ns)
(V/ns)
0.5
-
4.5
4.5
5.0
5.0
DDR400
Notes
Notes
Notes
MAX
4.0
h
h
h
i
i
i
Notes
j
j
j
e,k
a,c,d,f,g
b,c,d,f,g
a,c,d,f,g
b,c,d,f,g
Notes
Notes
Units
V/ns
Notes
a, k
Rev. 1.1 August. 2003
DDR SDRAM