BGY212 Philips Semiconductors, BGY212 Datasheet - Page 7

• Manufacturer Part Number: BGY212
• Description: UHF amplifier module
• Manufacturer: Philips Semiconductors

Philips Semiconductors
SOLDERING
The indicated temperatures are those at the solder
interfaces.
Advised solder types are types with a liquidus less than or
equal to 210 °C.
Solder dots or solder prints must be large enough to wet
the contact areas.
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these ovens.
A double reflow process is permitted.
Hand soldering is not recommended because the
soldering iron tip can exceed the maximum permitted
temperature of 250 °C and damage the module.
In case handsoldering is needed, recommendations can
be found in RNR-45-98-A-0485.
The maximum allowed temperature is 250 °C for a
maximum of 5 seconds.
The maximum ramp-up is 10 °C per second.
The maximum cool-down is 5 °C per second.
Cleaning
The following fluids may be used for cleaning:
• Alcohol
• Bio-Act (Terpene Hydrocarbon)
• Acetone.
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
1999 Aug 23
UHF amplifier module
7
handbook, halfpage
Fig.12 Recommended reflow temperature profile.
(°C)
300
200
100
T
0
0
1
2
3
Preliminary specification
4
BGY212A
t (min)
MGM159
5