TA31149 mu Rata, TA31149 Datasheet - Page 20

• Manufacturer Part Number: TA31149
• Description: kHZ Type Ceramic Discriminators
• Manufacturer: mu Rata

!Note
!Note
1. The component will be damaged when an excessive
2. In the case that the component is cleaned, confirm
3. In case of covering filter with over coat,
4. Do not use strong acidity flux, more than 0.2wt%
1. Do not use this product with bend. The component
2. The component will be damaged when an excessive
3. All kinds of re-flow soldering must not be applied
1. The component mounted on the PCB may be damaged if
2. Layout the components on the PCB to minimize the
3. After installing components, if solder is excessively
4. When the positioning claw or pick up nozzle are worn, the
5. When correcting component's position with a soldering
6. Do not clean or wash the component as it is not
7. In case of overcoating the part, coating conditions such
8. Accurate test circuit values are required to measure
stress is applied.
no reliability degradation is created.
conditions such as material of resin, cure
temperature, and so on should be evaluated well.
chlorine content, in re-flow soldering.
may be damaged if excess mechanical stress is
applied to it mounted on the printed circuit board.
stress is applied.
on the component.
CDBCB Series Notice (Handling)
CDBLA/CDBLB Series Notice (Handling)
CDSCA Series Notice (Handling)
excess mechanical stress is applied.
stress imposed by the warp or flexure of the board.
applied to the circuit board, mechanical stress will cause
destruction resistance characteristics to be lower. To
prevent this, be extremely careful in determining shape
and dimension before designing the circuit board diagram.
excess load is applied to the components while
positioning or placing are performed. Careful checking
and maintenance are necessary to prevent unexpected
trouble.
iron, the tip of the soldering iron should not directly touch
the chip component. Depending on the soldering
conditions, the effective area of terminations may be
reduced. The use of solder containing Ag should be
considerd to prevent the electrode erosion.
hermetically sealed.
as material, curing temperature, and so on must be
evaluated deeply.
electrical characteristics.
It may be a cause of mis-correlation if there is any
deviation, especially stray capacitance, from the test
circuit in the specification.
• Please read rating and !CAUTION (for storage and operating, rating, soldering and mounting, handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specification or transact the approval sheet for product specification before ordering.
Please read rating and !CAUTION (for storage and operating, rating, soldering and mounting, handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specification or to transact the approval sheet for product specificaion before ordering.
5. The product, packed in the moisture-proof bag (dry
4. Do not clean or wash the component as it is not
5. Do not use strong acidity flux, more than 0.2wt%
6. In case of covering discriminator with over coat,
pack), is sensitive to moisture.
The following treatment is required before applying
re-flow soldering, to avoid package cracks or
reliability degradation caused by thermal stress.
When unpacked, store the component in an atmosphere
of below 25C. and below 65%R.H., and solder within
48 hours.
hermetically sealed.
chlorine content, in flow soldering.
conditions such as material of resin, cure
emperature, and so on should be evaluated well.
[Component direction]
[Component layout close to board]
Perforation
Ceramic Discriminators Notice
A
Slit
B
C
Susceptibility to
stress is in the order
of : A>C>B
Put the
component
laterally to the
direction in
which stress
acts.
P05E11.pdf 02.9.2
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